OEM P/N:
ESCT P/N:
PART TYPE:
OEM:
The TEL focus ring (OEM P/N 2L10-252318-11, catalogued under the descriptor “RING, FOCUS LAB 360-315-5”) is a plasma-facing consumable that encircles the 300 mm wafer inside a Tokyo Electron capacitively coupled plasma etch chamber. It sits on the upper periphery of the electrostatic chuck, concentric with and immediately outboard of the wafer edge, forming the boundary between the silicon being processed and the surrounding chamber hardware. In a tool architecture where every millimetre of radius affects how plasma terminates at the wafer edge, the focus ring is one of the most consequential parts a process engineer ever touches.
Functionally, the focus ring extends the effective electrical and physical surface of the wafer beyond its actual edge. Without it, the plasma sheath would curve sharply downward at the wafer’s perimeter, bending ion trajectories away from vertical and causing tilted, tapered or otherwise distorted etch features in the outermost dies. By presenting a continuous, near-wafer-potential surface around the substrate, the ring keeps the sheath flat and the ion bombardment perpendicular all the way to the wafer edge, recovering die that would otherwise be scrapped.
Because it absorbs the same energetic ion and radical flux as the wafer, the focus ring is a true consumable. It erodes measurably over each campaign, and that erosion directly shifts edge etch behaviour. Treating the ring as a scheduled, tracked replacement item, rather than a fit-and-forget component, is fundamental to holding edge yield on a TEL etch platform.
In a Tokyo Electron CCP etch chamber, the focus ring works in concert with the electrostatic chuck, the cover (insulator) ring beneath it and the upper electrode to shape the plasma environment that the wafer edge sees. Its responsibilities span electrical, geometric and thermal domains:
Focus rings for 300 mm etch are precision-machined from plasma-grade materials selected for predictable erosion and low particle generation under aggressive fluorine- and chlorine-based chemistries. The exact material is matched to the application (high-resistivity silicon, silicon carbide or quartz are common edge-ring choices) and this part is supplied to the form, fit and function defined by the OEM specification.
The ring’s value lies in eroding slowly and predictably. A well-characterised material removes at a known rate, so the resulting downward shift in ring height and the change in edge sheath shape can be compensated through recipe offsets or planned replacement intervals, keeping edge CD within specification across the consumable’s life.
Concentricity, inner-diameter tolerance and surface finish all influence how the wafer seats relative to the ring and how cleanly the ring sheds reaction by-products. Loose tolerances or a rough surface promote polymer build-up and flaking, which becomes a defect source on subsequent wafers.
Because the focus ring directly governs the plasma environment at the wafer perimeter, its condition is visible in the data long before it is visible to the eye. As the ring wears, predictable yield and process signatures emerge:
The dominant wear mode is gradual thinning as ion bombardment sputters material from the ring’s upper surface. As the ring’s height drops, the sheath geometry at the wafer edge changes and edge CD drifts; this is expected, and the ring is replaced once it reaches its end-of-life thickness or wafer-count limit.
Thermal cycling, mechanical handling and localised arcing can crack or chip the ring. A fractured ring is an immediate particle hazard and can disturb wafer seating and RF coupling, so any visible crack, chip or arc burn warrants removal from service regardless of accumulated hours.
Polymer and reaction by-products accumulate on and around the ring. If this film flakes, it generates edge and backside particles; build-up on the seating surface can also tilt the ring or wafer, degrading edge uniformity and creating an intermittent contact path.
Focus ring replacement is a routine preventive-maintenance task, but its outcome depends on clean handling and correct seating. Always follow the relevant TEL maintenance procedure and site safety practices; the sequence below is a general guide:
Focus rings are consumed on a predictable cadence, so they belong in a managed kit alongside cover rings, electrodes and other edge hardware. Sourcing quality second-source consumables through ESCT Fab Support lets fabs hold uptime and edge yield without the cost and lead-time exposure of single-sourcing every ring:
It surrounds the 300 mm wafer on the electrostatic chuck and extends the plasma sheath beyond the wafer edge, keeping ion trajectories vertical so the outermost dies etch with the same profile and critical dimension as the wafer centre.
No. This is a second-source new part, supplied new and verified to the OEM form, fit and function for OEM P/N 2L10-252318-11. It is not an original Tokyo Electron OEM component and is not sold as one; it is offered as an OEM-compatible alternative.
Replace it when it reaches its established thickness or wafer-count end-of-life, or sooner if you see edge CD drift, rising edge-zone particles, or any visible crack, chip or arc damage during PM inspection.
Yes. A worn ring lets the edge sheath roll off, producing tilted profiles, edge-to-centre non-uniformity and lower edge-die yield, and a cracked ring can shed particles onto subsequent wafers. Timely replacement protects both yield and tool availability.
Indicative lead time is 4-5 weeks. Reorder using ESCT P/N ES7099-157, which is cross-referenced to OEM P/N 2L10-252318-11, and consider holding buffer stock so replacement always aligns with planned PM windows.
A fresh ring restores the original edge sheath geometry, so most fabs run a short season or conditioning recipe and verify edge etch performance after installation. If you had built recipe offsets to compensate for an aged ring, review and reset them on installing the new part.
The TEL focus ring (OEM P/N 2L10-252318-11, ESCT P/N ES7099-157) is a plasma-facing edge-confinement consumable that governs sheath shape, ion verticality and edge uniformity in Tokyo Electron 300 mm plasma etch chambers. Its predictable erosion makes it a planned-replacement item central to holding edge-die yield, controlling particles and maintaining stable RF coupling. Supplied as a second-source new part verified to OEM form, fit and function, with an indicative 4-5 week lead time, it offers fabs a cost-effective, well-controlled alternative for keeping TEL etch tools in specification.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 2L10-252318-11. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
Fill out the form below to request a quote for the part/s you require, making sure to include the OEM part number.
If the part you are looking for is not listed, get in touch and we will try to source it for you through our wide network of partners and suppliers.
