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The focus ring carrying TEL OEM part number 2L10-252052-11 is a consumable plasma-confinement component that sits in the outer annulus of a Tokyo Electron 300 mm plasma etch chamber, encircling the wafer at the perimeter of the electrostatic chuck. Its raw catalogue designation (“RING, FOCUS LAB 360-315-5.5”) describes a precision-machined annular ring whose nominal outer and inner diameters and section height position it directly at the wafer edge. In that location it does the unglamorous but critical work of extending the plasma sheath outward beyond the silicon, so that the reactive ion flux seen by the last few millimetres of the wafer matches the flux seen at the centre.
Without a focus ring, the electric field lines that drive ions toward the wafer would bend sharply at the wafer edge, tilting ion trajectories, distorting etch profiles and collapsing edge-die yield. The ring effectively “borrows” some of the wafer’s electrical and geometric continuity, presenting the plasma with a uniform surface that runs from the wafer centre to well past its edge. As a sacrificial part directly in the ion-bombardment path, it erodes over time and is replaced on a defined preventive-maintenance schedule rather than left to fail.
ESCT Fab Support supplies this focus ring under part number ES7099-135 as a 2nd source, brand-new component verified to the form, fit and function of the TEL original, giving fabs a cost-controlled, supply-secure alternative to single-sourced OEM consumables.
In a TEL 300 mm etch chamber the focus ring is the principal edge-conditioning consumable. It is concentric with the wafer and the electrostatic chuck, and it shapes the plasma sheath, the RF field and the gas environment at the wafer periphery, the region where uniformity is hardest to control and where the largest share of edge-die loss originates. Its core functions include:
Focus rings in TEL etch chambers are made from process-compatible materials (typically high-purity silicon, silicon carbide or quartz depending on the chemistry) because the ring is consumed by the same plasma that etches the wafer. Material choice governs erosion rate, particle behaviour and electrical coupling, and a 2nd source ring must replicate the OEM specification across all three.
The ring is fabricated to tight purity and structural specifications so that as it erodes it does not release metallic or particulate contamination onto the wafer. The erosion rate has to be consistent and predictable because it defines the maintenance interval and keeps process drift gradual and correctable.
The ring’s diameters, section height and seating geometry must match the OEM part precisely, because even small deviations shift the sheath profile and the gap between ring and wafer. The dielectric or semiconducting properties of the material also tune how the ring couples to the RF field at the edge.
Because the focus ring governs the edge environment, its condition translates directly into measurable wafer outcomes. A correctly specified, properly seated ring keeps edge die inside specification; a worn, mismatched or misaligned ring shows up immediately at electrical test. The practical consequences include:
The dominant wear mechanism is steady ion-bombardment erosion. As the ring thins, the height of the sheath relative to the wafer edge changes, ion angles tilt and edge etch results drift out of specification. This is the expected end-of-life condition that drives scheduled replacement.
Repeated thermal cycling and localised heating can crack or chip the ring, especially at the inner edge. A cracked ring is a sudden particle source and an arcing risk, and it can compromise the seating that the part relies on for thermal and electrical contact.
If the ring is not concentric with the wafer or does not seat flat, the gap around the wafer edge becomes uneven, producing azimuthal non-uniformity. Debris under the seating face, a warped ring or an out-of-tolerance part will all manifest as one-sided edge results.
Focus-ring replacement is a routine preventive-maintenance task, but cleanliness and alignment determine whether the new ring restores process performance. The following sequence reflects good practice for a TEL etch chamber; always follow the tool owner’s qualified procedure and current safety requirements.
Focus rings are high-turnover consumables, so their availability and cost directly shape a fab’s running expense and tool uptime. Sourcing them through ESCT Fab Support gives engineering and procurement teams a dependable second supply route alongside the OEM channel.
It surrounds the wafer at the edge of the electrostatic chuck and extends the plasma sheath beyond the wafer’s perimeter, keeping ion trajectories vertical and etch results uniform out to the last die. It also protects the chuck edge and acts as a sacrificial surface that absorbs plasma erosion.
No. This focus ring is supplied as a 2nd source, brand-new component that is verified to match the form, fit and function of TEL OEM P/N 2L10-252052-11. It is not an original OEM part and is not sold as one; it is an OEM-compatible alternative.
Most fabs replace the ring on a wafer-count or RF-hours interval derived from its measured erosion rate. Signs that replacement is due include edge etch-rate or critical-dimension drift, rising edge particle counts, or visible thinning, chipping or discolouration on inspection.
TEL focus rings are produced from process-compatible materials such as high-purity silicon, silicon carbide or quartz, selected to match the chamber chemistry, erosion behaviour and electrical coupling required. The ESCT part is manufactured to the equivalent material and dimensional specification as the OEM ring.
The indicative lead time is 4-5 weeks. Because focus rings are recurring consumables, we recommend factoring this into PM stocking levels and reorder points so that scheduled maintenance is never delayed waiting on parts.
When manufactured to the OEM specification and seated correctly, a 2nd source ring should reproduce the edge behaviour of the original. As with any consumable change, fabs typically qualify the part with monitor wafers and edge-uniformity checks before releasing it to volume production.
The focus ring under TEL OEM P/N 2L10-252052-11 (ESCT P/N ES7099-135) is an edge plasma-confinement consumable for Tokyo Electron 300 mm etch chambers. Seated around the wafer at the chuck perimeter, it shapes the plasma sheath and RF field to hold edge etch uniformity, protects the chuck hardware and serves as a planned sacrificial surface. Its erosion sets the maintenance interval, and its dimensional and material conformance directly affect edge-die yield, profile control and particle performance. ESCT supplies it as a 2nd source, brand-new, OEM-compatible part with an indicative 4-5 week lead time, giving fabs a cost-effective and supply-secure route for this high-turnover consumable.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 2L10-252052-11. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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