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The TEL focus ring identified by part name “RING, FOCUS LAB 360-315-5” is a precision-machined annular consumable that encircles the 300 mm wafer inside a Tokyo Electron plasma etch process chamber. Seated on the electrostatic chuck (ESC) immediately outboard of the wafer edge, the focus ring is one of the most influential single components governing how the plasma behaves across the outermost few millimetres of the substrate, the very region where edge-die yield is won or lost.
In a capacitively coupled etch chamber, the radio-frequency (RF) field terminates at the surfaces surrounding the wafer. Without a focus ring, the plasma sheath would curve sharply at the wafer perimeter, bending ion trajectories away from vertical and producing tilted, tapered or bowed features at the edge. The focus ring extends the conductive and dielectric environment of the wafer radially outward, so that the sheath stays flat and parallel across the wafer edge and the ion flux arrives at near-normal incidence right up to the bevel.
Because it sits directly in the ion-bombardment path, the focus ring is a sacrificial consumable: it erodes over time, and its rate of erosion is one of the dominant drivers of edge-process drift. Understanding its function, its wear behaviour and its replacement discipline is therefore central to sustaining uniformity and yield on any TEL 300 mm etch platform.
The focus ring performs several interrelated jobs simultaneously, blending electrostatic, plasma-physics and thermal functions into a single annular part that frames the wafer:
Focus rings for TEL 300 mm etch chambers are produced from process-grade materials selected for plasma resistance, electrical behaviour and low particle generation. Depending on the process and chamber zone, focus rings of this class are commonly manufactured from high-purity silicon, silicon carbide or quartz, with the material choice driving both lifetime and contamination performance.
The working surface must withstand sustained ion bombardment and aggressive fluorine- or chlorine-based chemistries without spalling, micro-cracking or generating particles. Material grade, purity and surface finish all dictate how slowly the ring recedes and how cleanly it erodes.
A focus ring only does its job if its inner diameter, height, flatness and step geometry match the wafer and chuck precisely. Small deviations translate directly into sheath distortion and edge non-uniformity, so machining tolerance and resistivity control are as important as bulk material choice.
Because the focus ring controls the edge sheath, its condition feeds directly into the metrics fab process engineers watch most closely. As the ring erodes and its height drops, the sheath geometry changes and edge results drift in predictable but costly ways:
The dominant failure mode is simple consumption. Continuous ion bombardment steadily removes material from the upper surface, lowering the ring and altering the sheath profile at the wafer edge. This is expected wear, but once height loss exceeds the process tolerance the ring must be replaced to keep edge CD and profile within specification.
Thermal cycling, mechanical handling and localised plasma attack can initiate micro-cracks or edge chips. These defects shed particles onto the wafer, drive defectivity excursions, and in severe cases can fracture during a cycle, contaminating the chamber and forcing an unplanned wet clean.
Over many cycles the ring surface can roughen or accumulate redeposited polymer and etch by-products. This changes the local secondary-electron and thermal behaviour, perturbs the sheath and can flake away as particles, all of which degrade edge uniformity before the ring has reached its erosion limit.
Focus ring replacement is a routine preventive-maintenance task, but it must be carried out cleanly and accurately because seating and concentricity directly affect edge performance. The following sequence reflects good practice; always follow your site’s approved TEL maintenance procedures and safety requirements.
Focus rings are high-frequency consumables, so a reliable, qualified supply keeps etch tools matched and available. ESCT Fab Support helps fabs and refurbishers secure this part (ESCT P/N ES7099-181, OEM P/N 2L10-252318-11) with the sourcing discipline that high-volume consumables demand:
It surrounds the 300 mm wafer on the electrostatic chuck and extends the plasma sheath beyond the wafer edge, keeping ion bombardment vertical at the perimeter. This preserves edge critical dimensions, profile shape and etch-rate uniformity on the outermost die.
No. This focus ring is supplied as a second-source new part that is verified to match the original Tokyo Electron component in form, fit and function. It is cross-referenced to OEM P/N 2L10-252318-11 for compatibility but is not an original OEM-branded part.
Lifetime depends heavily on the chemistry, RF power and duty cycle of your process. Rings are typically replaced on a measured part-life basis tied to erosion or edge-performance drift rather than a fixed calendar interval, so trend your edge metrics and set a replacement threshold accordingly.
As the ring erodes, the edge sheath flattens out of specification, causing edge CD drift, profile tilt and worsening uniformity. Worn or cracked rings also shed particles and can degrade chamber matching, ultimately costing edge-die yield and tool availability.
The typical lead time is 4–5 weeks. Because focus rings are consumed continuously, we recommend planning replenishment around your preventive-maintenance schedule and holding appropriate safety stock to avoid tool-down situations.
Yes. After a clean installation the chamber should be pumped down, leak-checked and seasoned or conditioned per your TEL procedure, followed by qualification wafers to confirm edge CD, profile and particle performance before returning the tool to production.
The TEL focus ring (OEM P/N 2L10-252318-11, ESCT P/N ES7099-181) is a wafer-edge plasma-shaping consumable that sits at the heart of edge etch performance on Tokyo Electron 300 mm etch chambers. By extending and flattening the plasma sheath beyond the wafer, it keeps ion bombardment vertical at the perimeter and protects edge-die critical dimensions, profile and uniformity. Like all focus rings it is sacrificial, eroding predictably under ion bombardment, so a disciplined replacement and qualification programme, backed by reliable spares, sustains yield, chamber matching and tool availability.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 2L10-252318-11. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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