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The Focus Ring 360-313.5-5 (TEL OEM P/N 2L10-252373-11, supplied by ESCT Fab Support as ES7099-180) is a consumable plasma-confinement ring used in Tokyo Electron 300 mm plasma etch process chambers. A focus ring is the annular component that surrounds the wafer at the level of the electrostatic chuck, bridging the abrupt electrical and geometric discontinuity at the wafer edge. It is one of the most consequential consumables in the chamber because the few millimetres of the wafer closest to its perimeter are the hardest to etch uniformly, and the focus ring is the part that the process engineer relies upon to extend a well-behaved plasma sheath out beyond the silicon and onto the ring itself.
The dimensional descriptor embedded in the part name, nominally a 360 mm outer reference with a 313.5 mm bore class, reflects a ring sized to seat concentrically around a 300 mm wafer, where the inner diameter is deliberately set close to, but slightly larger than, the wafer diameter so that the ring lips overlap the wafer edge without contacting the device area. In TEL etch platforms this ring sits on the cathode assembly, directly inboard of the chamber wall liners and outboard of the chuck dielectric, and it is exposed continuously to fluorocarbon, oxygen and inert-gas plasmas together with directional ion bombardment.
Because the focus ring erodes in service, it is a scheduled-replacement item rather than a permanent assembly. Its condition at any point in the preventive-maintenance cycle directly shapes edge etch rate, edge critical-dimension control and edge-exclusion yield, which is why fabs treat a qualified, consistent supply of focus rings as a process-stability requirement rather than a simple spares line item.
The focus ring performs several interlocking jobs at the wafer edge simultaneously, and a healthy ring is one that keeps all of them within specification across thousands of RF hours:
Focus rings for TEL etch chambers are manufactured from process-compatible materials selected to resist the specific plasma chemistry they face, commonly high-purity silicon, silicon carbide or quartz, depending on the recipe and the surrounding chamber kit. The material must erode in a controlled, predictable manner and must not introduce metallic or particulate contamination as it wears. ES7099-180 is supplied to match the OEM material specification and surface finish so that erosion behaviour, sputter yield and consumption rate track the original part across the maintenance interval.
Sheath shaping at the wafer edge is acutely sensitive to ring height, step geometry and the radial gap between the ring bore and the wafer rim. Small departures from the nominal profile shift the sheath boundary and degrade edge uniformity, so flatness, concentricity and the machined step around the 313.5 mm bore are held to tight tolerances.
Because the focus ring governs the electrical and physical environment of the outermost annulus of every wafer, its state has a direct and measurable bearing on production outcomes:
The dominant wear mechanism is gradual sputtering and chemical erosion of the upper surface and inner step, which lowers the ring height over RF hours. As the ring thins, the sheath at the edge collapses inward, edge etch rate shifts and the process slowly walks out of specification, which is why focus rings are replaced on consumption-based intervals rather than run to destruction.
Thermal cycling, mechanical handling and RF stress can initiate cracks or edge chips, particularly in brittle ceramic or silicon material. A cracked ring is a particle source and an immediate yield risk, and any visible fracture or chip is grounds for rejection at installation or removal.
Polymer and by-product films can accumulate on the ring surface; if they flake they generate defects, and localised charge build-up or compromised contact can cause micro-arcing that pits the ring and destabilises the edge plasma. Discoloration, flaking deposits or arc marks at inspection indicate the ring should be replaced.
Focus-ring replacement is a routine preventive-maintenance activity, but it must be carried out cleanly and concentrically to preserve edge performance. The following sequence reflects general good practice; always follow your site’s TEL maintenance documentation and lock-out procedures:
Focus rings are high-frequency consumables, so the economics and availability of the supply chain matter as much as the part itself. Sourcing ES7099-180 through ESCT Fab Support gives fab maintenance and procurement teams a dependable alternative for keeping TEL etch chambers in qualified condition:
It surrounds the 300 mm wafer at the chuck level and extends the plasma sheath outward beyond the wafer edge. By doing so it keeps ion trajectories vertical and the etch uniform right to the device edge, while acting as a sacrificial surface that protects the cathode and chuck periphery.
No. ES7099-180 is supplied as a 2nd-source, new part that is verified to match the form, fit and function of TEL OEM P/N 2L10-252373-11. It is not an original OEM-branded component, and TEL part numbers are quoted for cross-reference and identification only.
Focus rings are consumables replaced on a consumption-based schedule tied to RF hours and erosion, not on a fixed calendar. The exact interval depends on the etch recipe, chamber and process aggressiveness, so the replacement point should be set from your own edge-uniformity and consumption data.
As the ring thins, the edge sheath collapses inward, edge etch rate and critical dimension drift, and edge dies fall out of specification. Excessive wear can also expose underlying hardware and raise particle counts, so running beyond the qualified consumption limit risks measurable yield loss.
Focus rings for TEL etch chambers are made from process-compatible materials such as high-purity silicon, silicon carbide or quartz, chosen to match the plasma chemistry and erosion behaviour of the original part. ES7099-180 is supplied to the OEM material specification so that consumption rate and contamination performance track the part it replaces.
The typical lead time is 4-5 weeks. Order against ESCT P/N ES7099-180, cross-referenced to TEL OEM P/N 2L10-252373-11, and ESCT Fab Support can confirm current availability and quantities for your preventive-maintenance schedule.
The Focus Ring 360-313.5-5 (ES7099-180, cross-referenced to TEL OEM P/N 2L10-252373-11) is a critical edge-confinement consumable for Tokyo Electron 300 mm plasma etch chambers. By extending and shaping the plasma sheath beyond the wafer rim, it controls edge etch rate, edge critical dimension and edge-exclusion yield while sacrificially protecting the cathode and chuck. Supplied as a 2nd-source new part matched to the OEM in material, dimensions and finish, with a typical 4-5 week lead time, it offers fabs a dependable, cost-effective route to keeping etch chambers qualified and stable across preventive-maintenance cycles.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 2L10-252373-11. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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