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ESCT P/N:
PART TYPE:
OEM:
The 2L10-252181-11 RING, FOCUS LAB 360-310-5 is a precision-engineered silicon plasma-facing component used in Tokyo Electron (TEL) semiconductor processing equipment to support plasma confinement, wafer edge conditioning, and repeatable chamber performance during advanced etch and plasma processing applications.
Installed around the wafer process zone, the focus ring helps shape the plasma environment near the wafer perimeter, promoting uniform ion distribution and controlled edge processing conditions. In semiconductor manufacturing environments where plasma uniformity directly impacts critical dimension control, etch profile consistency, and overall wafer yield, so maintain focus ring integrity.
Because focus rings operate under continuous plasma exposure, ion bombardment, thermal cycling, and reactive process chemistries, erosion, dimensional wear, contamination buildup, or surface degradation can gradually affect chamber performance. The 2L10-252181-11 is designed to support stable chamber conditions and consistent wafer processing throughout its service life.
The ESCT equivalent part number for this component is ES7099-153, supplied as a 2nd Source NEW OEM-compatible replacement designed to meet form, fit, and functional requirements aligned with the original TEL component.
The 2L10-252181-11 functions as a critical plasma-management and chamber-conditioning component.
Core functions include:
In many TEL plasma-processing platforms, focus rings operate alongside electrodes, ground rings, ESC assemblies, chamber liners, and other plasma-facing consumables.
The focus ring helps maintain controlled plasma behavior.
Key performance characteristics include:
Stable edge conditions are critical for maintaining process consistency and yield.
Material quality directly affects chamber performance.
Performance attributes may include:
Silicon focus rings are widely used in semiconductor manufacturing due to their process compatibility and contamination-control characteristics.
The 360-310-5 profile supports stable chamber operation.
Durability characteristics may include:
Dimensional consistency helps preserve chamber qualification and process repeatability.
The 2L10-252181-11 may operate alongside related chamber components including:
Together these components support broader chamber stability and process control.
The 2L10-252181-11 can directly influence chamber performance and equipment availability.
Potential impacts of wear or degradation include:
Replacing a worn focus ring can help restore chamber stability and improve process repeatability.
Continuous plasma exposure gradually affects ring performance.
Indicators include:
Long-term process exposure may affect ring geometry.
Symptoms may include:
Wear progression may influence contamination control.
Indicators include:
Wear in the 2L10-252181-11 may also increase stress on adjacent chamber consumables and plasma-facing hardware.
To support best performance:
The 2L10-252181-11 Focus Ring LAB 360-310-5 is an OEM-referenced TEL component.
Key considerations:
OEM P/N: 2L10-252181-11 ESCT P/N: ES7099-153 Part Type: 2nd Source NEW OEM: TEL
Maintaining inventory of the ES7099-153 / 2L10-252181-11 can reduce downtime exposure and improve maintenance readiness.
It helps control plasma behavior around the wafer edge, supporting process uniformity, plasma stability, and repeatable chamber performance.
Focus rings influence plasma confinement and edge conditions, which directly affect process repeatability, critical dimensions, and wafer yield.
It identifies a specific TEL focus ring geometry and dimensional configuration designed for compatible chamber architectures and process requirements.
4. What are signs the focus ring may need replacement?
Common indicators include:
Yes. Changes in ring geometry or surface condition can alter plasma behavior and impact wafer processing consistency.
Yes. Surface degradation may increase particle generation and contamination risks.
Yes. Plasma instability and contamination-related issues can directly impact wafer quality and production yield.
Issues are commonly identified through PM inspections, chamber qualification results, particle trend analysis, plasma diagnostics, or visual wear assessment.
Yes. Chamber qualification and process verification should be performed after replacement.
Incorrect dimensions or material characteristics may affect plasma behavior, chamber performance, and process outcomes.
No. This product is supplied as ESCT P/N ES7099-153, a 2nd Source NEW OEM-compatible replacement aligned with the original TEL component requirements.
Yes. Chamber configuration, dimensions, and process compatibility should always be confirmed.
Yes. ESCT supports compatibility verification based on equipment and application requirements.
Depending on availability, associated ground rings, electrodes, shields, inner cells, and other plasma-facing chamber components may also be supported.
Preventive replacement helps maintain plasma stability, reduce particle-related defects, preserve process uniformity, and minimize unplanned production interruptions.
The 2L10-252181-11 Focus Ring LAB 360-310-5 is a critical plasma-facing chamber consumable supporting plasma confinement, edge uniformity, and repeatable semiconductor process performance in TEL systems.
Its condition can directly influence process stability, contamination control, equipment uptime, and wafer yield.
Sourcing through ESCT Fab Support as ES7099-153 provides a verified 2nd Source NEW OEM-compatible replacement backed by semiconductor-focused expertise, quality verification, and responsive supply support.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 2L10-252181-11. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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