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The TEL Focus Ring identified by the laboratory designation “360-307.6-5” and OEM part number 2L10-252182-11 is a consumable plasma-confinement ring that sits at the immediate outer perimeter of the electrostatic chuck (ESC) in a Tokyo Electron 300 mm plasma etch chamber. Encircling the 300 mm wafer, the focus ring extends the plasma sheath outward beyond the wafer edge so that the reactive-ion environment seen by the outermost die mirrors, as closely as possible, the environment seen at wafer centre. In plasma etch, the wafer edge is the single hardest region to control, and the focus ring is the component most directly responsible for taming it.
Functionally, the ring acts as a sacrificial extension of the wafer plane. Because it is RF-coupled to the same lower electrode as the wafer, it carries the electric field and sheath profile across the wafer boundary and onto a replaceable surface that absorbs ion bombardment instead of the chamber hardware. The numerical descriptor in the part name reflects dimensional and revision data associated with the ring geometry; what matters in service is that the part presents the correct inner diameter, outer diameter, height and bevel profile to seat precisely against the chuck and present the intended sheath-shaping surface to the plasma.
As a frontline consumable, this focus ring is one of the most frequently scheduled replacement items in any high-volume etch fab. It erodes predictably under ion flux, and that erosion is tracked, compensated for and ultimately reset by part replacement. Keeping a qualified, dimensionally accurate ring on the shelf is therefore central to chamber availability, edge yield and recipe stability.
The focus ring is far more than a passive spacer. In a TEL capacitively coupled etch chamber it performs several interrelated electrical and geometric duties that together determine how uniform the etch is at the wafer edge.
Focus rings for TEL etch chambers are manufactured from high-purity, plasma-resistant materials chosen to balance erosion rate, particle generation and electrical behaviour. The material set and its dimensional precision are what separate a ring that holds edge yield through a full kit life from one that drifts early.
Depending on the etch application, focus rings are produced from high-purity silicon, silicon carbide, quartz or a comparable plasma-grade ceramic. The material must erode slowly and, critically, evenly under fluorine- or chlorine-based chemistries, since the rate at which the ring recedes directly drives how quickly the edge sheath profile changes over the chamber’s running life.
Beyond chemistry, the ring’s flatness, height tolerance, bevel angle and inner-diameter clearance to the wafer must match the OEM specification. Even small deviations alter the local sheath shape and the RF coupling at the edge, so dimensional and resistivity conformity are as important as raw plasma resistance.
Because the focus ring governs the edge exclusion zone directly, its condition translates straight into measurable device and tool metrics. A worn or out-of-spec ring is one of the most common root causes of edge-region yield loss in plasma etch.
As an intentionally sacrificial part, the focus ring is expected to wear; the engineering goal is to replace it before its drift pushes edge performance out of specification. The dominant degradation mechanisms are well understood.
Continuous ion bombardment steadily thins the ring and lowers its top surface. As height is lost, the sheath at the wafer edge tilts and the ion angle shifts, producing a progressive change in edge etch rate and profile that eventually exceeds the recipe’s ability to compensate.
Repeated thermal cycling and localised hot spots can initiate micro-cracks, particularly in brittle ceramic or silicon rings. A cracked ring sheds particles onto the wafer edge and can disturb the local field, making it a frequent cause of sudden defect excursions.
Etch by-products and polymer can accumulate on the ring surface, and surface roughening or contamination can seed micro-arcing. Arc events damage both the ring and adjacent hardware while generating particles, so a ring showing arc tracks should be retired promptly.
Focus ring replacement is a routine preventive-maintenance activity, but it must be carried out cleanly and precisely because the ring sits directly against the electrostatic chuck. The following sequence reflects general good practice; always defer to your site’s TEL maintenance procedure and safety permits.
Focus rings are scheduled consumables, which makes their supply a planning problem as much as a technical one. ESCT Fab Support helps fabs keep these high-turn parts available without over-committing to single-source OEM channels.
It encircles the 300 mm wafer at the edge of the electrostatic chuck and extends the plasma sheath outward, so the ion environment at the extreme wafer edge matches the wafer interior. This is what keeps edge etch rate, critical dimension and profile uniform.
No. This is supplied as a second-source new part that is verified to the OEM form, fit and function for TEL P/N 2L10-252182-11. It is a new OEM-compatible component and is not an original Tokyo Electron branded part.
Replacement is normally driven by accumulated RF hours or wafer count tracked against a qualified ring-life limit, and confirmed by edge-uniformity drift, rising edge particle counts or visible erosion and cracking during preventive maintenance.
TEL focus rings are made from high-purity plasma-resistant materials such as silicon, silicon carbide, quartz or a comparable ceramic, selected to match the etch chemistry and to deliver predictable, low-particle erosion behaviour.
Used within its qualified life and installed correctly, a dimensionally conforming ring supports consistent edge behaviour across a fleet. Because ring variation can drive mismatch, conformity to the OEM geometry and resistivity is exactly what protects matched performance.
The current lead time is 4-5 weeks. Because focus rings are a scheduled consumable, we recommend aligning orders with your preventive-maintenance calendar so qualified stock is on hand before each kit change.
The TEL Focus Ring 360-307.6-5 (OEM P/N 2L10-252182-11, ESCT P/N ES7099-144) is a sacrificial plasma-confinement consumable that shapes the sheath and RF return path at the very edge of the 300 mm wafer in Tokyo Electron etch chambers. Its material purity, dimensional conformity and predictable erosion directly govern edge uniformity, particle performance and chamber matching, tying timely, like-for-like replacement to yield and availability. Supplied as a second-source new part on a 4-5 week lead time, it offers fabs a verified, supply-resilient route to keeping this high-turn item in stock.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 2L10-252182-11. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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