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The Focus Ring referenced by TEL part number 2L10-252694-11 is a precision-machined annular consumable that sits in the wafer-edge region of a Tokyo Electron 300 mm plasma etch process chamber. It is one of the family of edge-conditioning components, the “306-T5 STEP LAB” descriptor reflects the specific stepped profile and laboratory-qualified geometry that defines how this ring couples to the electrostatic chuck and the wafer it surrounds. In service it forms the immediate annular boundary around the 300 mm wafer, extending the active plasma region beyond the wafer edge so that the last few millimetres of die at the perimeter see process conditions comparable to those at the wafer centre.
Focus rings are among the most heavily consumed parts in any high-density plasma etch tool. They are continuously exposed to energetic ions, reactive radicals and the RF fields that drive the discharge, and their stepped geometry is engineered to shape the sheath above the wafer edge. Because the ring erodes during normal operation, its dimensions, surface condition and electrical behaviour drift over time, and that drift is directly visible in edge etch results. For this reason the focus ring is treated as a planned-replacement consumable with a defined service interval rather than a permanent chamber fixture.
This listing covers a second-source, new focus ring manufactured to match the form, fit and function of the original TEL component, offered under ESCT part number ES7099-208 with a typical lead time of 4–5 weeks. It is intended as a cost-effective, qualified alternative for fabs maintaining 300 mm TEL etch fleets that need to hold adequate consumable stock without committing exclusively to OEM supply.
In a TEL 300 mm etch chamber the focus ring is mounted concentrically around the wafer, seated on the electrostatic chuck and cathode assembly. Its principal job is to extend and confine the plasma uniformly across the full wafer diameter, but it performs several distinct electrical and process functions simultaneously.
Focus rings of this class are produced from plasma-resistant materials selected for low contamination and predictable erosion behaviour under aggressive fluorine- and chlorine-based chemistries. Material choice and surface finish dominate the part’s service life and its effect on yield.
The ring must tolerate sustained ion bombardment and reactive-species attack while eroding slowly and evenly. Common construction for TEL edge rings of this type uses high-purity silicon, silicon carbide or quartz-class ceramics, chosen so that any erosion products are process-compatible rather than yield-killing contaminants.
The stepped “STEP LAB” geometry only delivers correct sheath shaping if the ring is machined to tight tolerances and seats flat and concentric on the chuck. Surface finish and flatness govern both RF coupling and particle generation.
Because the focus ring conditions the plasma exactly where edge die are processed, its condition has an outsized influence on edge yield and on overall tool stability. A worn or out-of-spec ring shows up quickly in production metrics.
A focus ring is a sacrificial part, so it does not so much “fail” as gradually drift out of specification, though abrupt failures do occur. Understanding the dominant wear mechanisms helps set a sensible replacement interval.
Continuous ion bombardment slowly removes material from the upper surfaces and the step, lowering the ring relative to the wafer and altering the sheath shape. As step height is lost, edge etch rate and profile angle drift, and beyond a threshold the ring can no longer hold edge uniformity even with recipe compensation.
Repeated thermal cycling, mechanical mishandling during a swap, or seating against debris on the chuck can crack a ceramic or silicon ring. A crack creates a sudden particle source, disturbs local RF coupling and, in the worst case, allows fragments to reach the wafer and damage the chuck surface.
As the ring ages its surface roughens and accumulates polymer and redeposited films. Eventually these layers flake, raising on-wafer defect counts. A ring that still measures within dimensional limits can therefore still warrant replacement on particle-performance grounds alone.
Replacing a focus ring is a routine but exacting preventive-maintenance task. Always follow the tool owner’s approved PM procedure and lockout/tagout requirements; the steps below summarise good practice.
Focus rings are scheduled-replacement items, so consumable availability directly governs tool uptime. Sourcing qualified second-source rings such as ES7099-208 alongside OEM stock gives planners flexibility and protects against single-supplier shortages.
It surrounds the 300 mm wafer and extends the plasma sheath past the wafer edge, so the outermost dies see the same ion flux, ion energy and etch profile as the wafer centre. Its stepped “306-T5 STEP LAB” geometry shapes the field at the perimeter to keep edge features uniform and vertical.
No. This is a new, second-source component manufactured to match the form, fit and function of the original Tokyo Electron part. It is not an original OEM part and is not supplied by or affiliated with TEL; it is offered as a qualified, compatible alternative under ESCT P/N ES7099-208.
The usual indicators are drifting edge etch-rate uniformity, profile tilt or CD shift on the outermost dies, rising particle counts, and measured step-height loss against the qualified baseline. Most fabs set a replacement interval in RF hours or wafer count and confirm it with periodic uniformity and particle checks.
Focus rings of this class are made from high-purity plasma-resistant materials such as silicon, silicon carbide or quartz-class ceramics, selected for slow, uniform erosion and process-compatible by-products. The specific material is matched to the original part so erosion and electrical behaviour reproduce the qualified condition.
A focus ring swap is part of routine preventive maintenance, but because it directly affects edge performance, most fabs run a season or burn-in recipe followed by a qualification wafer to confirm edge uniformity, particle levels and chamber matching before returning the tool to production.
This ring carries a typical lead time of 4–5 weeks and is ordered under ESCT P/N ES7099-208, cross-referenced to TEL OEM P/N 2L10-252694-11. Planning orders around your PM schedule and holding buffer stock helps avoid tool downtime waiting on a consumable.
The Focus Ring ES7099-208 (TEL OEM P/N 2L10-252694-11) is a stepped, plasma-confining edge consumable for Tokyo Electron 300 mm plasma etch chambers. It extends and shapes the plasma sheath at the wafer perimeter, protects the chuck and cathode from ion bombardment, and is central to edge etch uniformity, profile control and particle performance. As a sacrificial part it erodes predictably and is replaced on a planned interval. Supplied new and second-sourced to OEM-equivalent form, fit and function with a 4–5 week lead time, it gives TEL etch fleets a cost-effective, dual-source option for keeping critical consumable stock on hand.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 2L10-252694-11. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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