2L10-252397-11
RING, FOCUS LAB 360-314.2-5

Focus ring LAB 360-314.2-5 (OEM P/N 2L10-252397-11), edge-control focus ring for TEL 300 mm plasma etch systems

ESCT P/N ES7099-179, Tokyo Electron (TEL) compatible plasma etch focus ring

The Focus Ring LAB 360-314.2-5 (OEM P/N 2L10-252397-11) is a circular plasma-confinement consumable that surrounds the 300 mm wafer within a Tokyo Electron (TEL) plasma etch process chamber. It sits concentrically around the electrostatic chuck, framing the wafer edge so that the reactive plasma sheath extends smoothly past the silicon perimeter rather than collapsing abruptly at the wafer boundary. In doing so, it determines whether the outermost few millimetres of every wafer etch at the same rate, profile and selectivity as the centre.

In TEL etch architecture, the focus ring is one of the most heavily duty-cycled parts in the chamber. It is exposed to continuous ion bombardment and reactive fluorine, chlorine or bromine chemistries, and it erodes measurably over the course of normal production. As it wears, the local sheath geometry shifts, so the focus ring is treated as a scheduled-replacement item with a defined wafer-count or RF-hour lifetime rather than a permanent fixture.

Because edge die represent real, saleable silicon on a 300 mm wafer, the condition of this ring has a direct and quantifiable effect on yield. A worn, cracked or incorrectly seated focus ring is one of the most common root causes of edge etch-rate drift and tilted feature profiles in the wafer’s outer annulus, which is why correct part selection and disciplined replacement matter so much.

Functional role of the focus ring in TEL plasma etch platforms

The focus ring is not a passive spacer. It is an active element of the plasma electrical and chemical environment, shaping the sheath and the RF field at the precise location where edge uniformity is most fragile. Its principal functions include:

• Extending the plasma sheath radially outward beyond the wafer edge so the etch field stays uniform across the outermost die.
• Confining and shaping the plasma over the wafer perimeter to prevent sheath bending that would tilt etch features near the edge.
• Presenting a controlled dielectric or semiconducting surface that influences local impedance and RF coupling at the wafer boundary.
• Protecting the underlying electrostatic chuck and edge hardware from direct ion bombardment and chemical attack.
• Acting as a sacrificial consumable that erodes preferentially, so the more expensive chamber components beneath it are preserved.
• Maintaining a repeatable thermal and geometric boundary condition at the wafer edge from one process run to the next.

Material and process performance

Focus rings in TEL etch chambers are manufactured from process-grade materials selected for plasma resistance and electrical behaviour, most commonly high-purity silicon, silicon carbide or quartz depending on the chemistry and the specific etch step. The material choice governs both erosion rate and the part’s influence on the plasma, so a compatible replacement must replicate the original specification, not merely the dimensions.

Plasma and chemical resistance

The ring must withstand prolonged exposure to energetic ions and aggressive halogen chemistries without shedding particles or eroding unevenly. Material purity and microstructure determine how cleanly it sacrifices itself over its service life.

• High-purity feedstock to minimise metallic contamination that could transfer to the wafer.
• Controlled microstructure for predictable, even erosion rather than localised pitting.
• Resistance to micro-cracking under repeated thermal and RF cycling.

Dimensional and electrical conformance

The 360-314.2-5 designation reflects the ring’s controlled diameter and profile, which must match the chamber so the sheath geometry and impedance at the wafer edge are reproduced exactly. Small deviations translate directly into edge process drift.

• Tight inner and outer diameter tolerances to seat concentrically around the wafer.
• Controlled thickness and step profile to set the correct sheath extension height.
• Flatness and surface finish for consistent thermal contact and RF return behaviour.

Impact on tool performance and yield

Because the focus ring governs the etch environment exactly where the most peripheral die sit, its condition feeds straight through to measurable process and yield metrics:

• Edge-to-centre etch-rate uniformity, which a worn ring degrades first at the wafer perimeter.
• Feature profile and tilt control on edge die, governed by sheath shape over the ring.
• Critical dimension (CD) repeatability across the outer wafer annulus from lot to lot.
• Particle performance, since a cracked or heavily eroded ring becomes a defect source.
• Edge die yield, the ultimate commercial consequence of edge process drift.
• Chamber-matching across a fleet of tools running the same recipe.

Common wear and failure modes

As a sacrificial consumable, the focus ring is expected to wear, but the manner of wear and the failure events that can occur determine when it must be replaced.

Erosion and thickness loss

Continuous ion bombardment thins the ring over its service life. As the upper surface recedes, the sheath extension height falls and the etch field over the wafer edge weakens, producing progressive edge etch-rate drift and tilted edge profiles long before any visible damage.

Cracking and chipping

Thermal cycling and RF stress can initiate micro-cracks that propagate into chips or fractures, particularly in thinner, more eroded rings. A fractured ring is both a sudden uniformity excursion and a major particle source, and it warrants immediate replacement.

Particle generation and contamination

Late-life rings, surface deposits and uneven erosion all shed particulate that lands on the wafer as killer defects. Contamination from an impure or out-of-spec ring can also alter local plasma chemistry, compounding the yield impact.

Installation and replacement guidance

Focus ring replacement is a routine preventive-maintenance task, but it must be performed cleanly and concentrically to restore baseline edge performance. Follow the tool’s documented procedure; the typical sequence is as follows:

• Vent the chamber and isolate it from RF and process gases following the approved lockout procedure.
• Remove the worn ring carefully, avoiding contact with the electrostatic chuck surface beneath it.
• Inspect and clean the seating area, removing any deposits, debris or chips left by the old ring.
• Handle the new ring with clean, powder-free gloves to avoid surface contamination and fingerprints.
• Seat the replacement concentrically, confirming it is flat, fully home and free of rock or gap.
• Pump down, perform any required season or burn-in cycles, and verify chamber pressure and leak rate.
• Run qualification wafers and confirm edge etch-rate uniformity and particle counts before returning to production.

Spare parts strategy for TEL etch consumables

Focus rings are scheduled-replacement consumables, so a reliable supply at predictable cost is central to fab uptime. ESCT Fab Support offers ES7099-179 as a compatible alternative to OEM P/N 2L10-252397-11, with advantages that include:

• A second-source NEW part verified to the form, fit and function of the original TEL ring.
• Competitive pricing on a high-turnover consumable that is replaced repeatedly over a tool’s life.
• A typical lead time of 4-5 weeks, supporting planned preventive-maintenance scheduling.
• Material and dimensional conformance to preserve edge uniformity and particle performance.
• A second-source option that reduces single-supplier dependency for critical etch consumables.

Frequently asked questions

What does this focus ring do in a TEL etch chamber?

It surrounds the 300 mm wafer and extends the plasma sheath past the wafer edge, keeping etch rate, profile and selectivity uniform across the outermost die. It also protects the electrostatic chuck and edge hardware from ion bombardment.

Is this an original OEM part?

No. ES7099-179 is supplied as a second-source NEW, OEM-compatible focus ring verified to the form, fit and function of TEL OEM P/N 2L10-252397-11. It is not an original Tokyo Electron branded part.

How often does a focus ring need replacing?

Service life depends on the recipe, chemistry and RF duty cycle, so rings are replaced on a defined wafer-count or RF-hour interval set by the fab. They are scheduled-replacement consumables rather than permanent components.

What are the signs a focus ring is worn out?

Typical indicators are edge etch-rate drift, tilted feature profiles on edge die, rising particle counts and visible thinning, cracking or chipping during preventive-maintenance inspection. Any crack or fracture calls for immediate replacement.

What is the lead time for ES7099-179?

The typical lead time is 4-5 weeks. Because focus rings are consumed on a predictable schedule, we recommend ordering against your planned maintenance calendar to maintain buffer stock and avoid unplanned downtime.

Will this ring affect my edge yield and particle performance?

A correctly specified, properly seated ring restores baseline edge uniformity and particle behaviour. ES7099-179 is verified to the original material and dimensional specification so that sheath geometry, impedance and erosion behaviour at the wafer edge are reproduced.

Summary

The Focus Ring LAB 360-314.2-5 (OEM P/N 2L10-252397-11), supplied by ESCT Fab Support as ES7099-179, is a sacrificial plasma-confinement consumable for TEL 300 mm plasma etch chambers. It shapes the plasma sheath at the wafer edge to maintain edge-to-centre uniformity, profile control and particle performance, eroding predictably so that more costly chamber hardware is preserved. As a second-source NEW part verified to form, fit and function, it offers a cost-effective, well-supported alternative for fabs managing the recurring replacement of this critical etch consumable.

Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 2L10-252397-11. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.

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