OEM P/N:
ESCT P/N:
PART TYPE:
OEM:
The TEL Focus Ring 380-T6.5 (OEM P/N 3D10-250158-11) is an insulating consumable ring fitted to the wafer-edge region of Tokyo Electron 300 mm plasma etch process chambers. The raw descriptor “FOCUS RING, 380-T6.5, IN303(CP)” encodes its identity: it is a focus ring designed for 380 mm-class chamber hardware, manufactured to a nominal thickness profile of around 6.5 mm, and built from an insulating ceramic material (the “IN” prefix indicating an insulator grade rather than a conductive silicon or graphite part). It encircles the electrostatic chuck and the production wafer, sitting flush against the outer rim of the substrate to extend the plasma sheath beyond the wafer edge.
In a plasma etch chamber, the few millimetres of real estate at the wafer perimeter are the hardest to control. Without a sacrificial ring surrounding the substrate, the sheath collapses inward at the wafer edge, ion trajectories tilt, and etch rate and profile drift away from the centre-die target. The focus ring corrects this by presenting a continuous dielectric surface that the sheath can stand on, effectively making the wafer “look” larger to the plasma so that the usable area extends all the way to the bevel. As an insulating part, this particular ring shapes the local electric field by virtue of its permittivity rather than by carrying RF current, which distinguishes it from conductive silicon focus rings used in other process recipes.
Because it is positioned directly in the ion flux and consumed steadily over thousands of RF hours, the focus ring is one of the most frequently replaced consumables in any TEL etch fleet. Its dimensional stability and material consistency map almost one-to-one onto edge-die yield, making a reliably sourced, dimensionally accurate replacement a genuine production lever rather than a commodity buy.
Within a Tokyo Electron 300 mm etch chamber, the 380-T6.5 insulating focus ring performs several interlocking functions that together define how cleanly the wafer edge is processed:
As an insulator-grade ring, the 380-T6.5 is selected for stable dielectric properties and resistance to fluorine- and chlorine-based etch chemistries. Its permittivity is a tuned process variable: it sets how the sheath bends at the wafer edge, so material composition and density must be held within tight tolerances batch to batch.
The nominal 6.5 mm thickness class and the inner and outer diameters that mate to the chuck rim are critical to function. A ring that sits even fractionally proud or recessed shifts the sheath height relative to the wafer surface, directly altering edge etch rate and tilt.
Because the focus ring governs the most marginal region of the wafer, its condition feeds straight through to fab-level metrics:
The dominant wear mode is gradual ion-driven erosion that thins the ring and recesses its top surface over RF hours. As the effective height drops, the sheath sits lower relative to the wafer and edge etch behaviour drifts, eventually pushing edge dies outside specification and triggering scheduled replacement.
As a ceramic insulator, the ring is vulnerable to thermal-cycling stress, mechanical mishandling during preventive maintenance, and chipping at the inner rim. Cracks compromise dielectric continuity and become particle generators, so any visible damage on inspection should condemn the part immediately.
Etch by-products and polymer films accumulate on the ring surface, while halogen attack roughens it over time. Both alter the local field and gas conductance and can flake into the process; once cleaning no longer restores the surface, the ring has reached end of life.
Focus ring replacement is a routine preventive-maintenance task but, as an edge-critical dielectric component, it rewards careful, contamination-free handling. The following sequence reflects general good practice and should be carried out in line with your site’s qualified TEL procedures:
Focus rings are scheduled-replacement consumables, so the constraint is rarely whether a ring is needed but whether the right ring is on the shelf when the chamber is opened. ESCT Fab Support supplies the ES7099-083 as a managed alternative to single-source OEM procurement:
It surrounds the wafer at the chuck rim and extends the plasma sheath outward past the wafer edge. As an insulating ring it shapes the edge electric field through its dielectric properties, keeping ion trajectories vertical and edge etch behaviour matched to the centre of the wafer.
No. This ES7099-083 is supplied as a second-source NEW, OEM-compatible part. It is a new component verified to the form, fit and function of TEL OEM P/N 3D10-250158-11, but it is not an original Tokyo Electron OEM part and is not represented as one.
The “IN” designation indicates an insulator-grade material. Some recipes pair the wafer with a conductive silicon focus ring that participates in the RF path, while others call for a dielectric ring that tunes the edge field through permittivity alone. This part is the insulating variant for chambers configured to that scheme.
Service life depends on chemistry, power and duty cycle, so it is governed by your qualified consumable-life limits rather than a fixed figure. The ring is replaced once erosion-driven thickness recession begins to push edge uniformity or particle performance outside specification.
The part is supplied new from a second source with a typical lead time of 4–5 weeks. Planning replenishment against this window and your PM cadence helps avoid chamber downtime waiting on an edge-critical consumable.
Cross-reference your existing OEM part number 3D10-250158-11 and the 380-T6.5 designation against your chamber configuration. Because edge hardware is recipe- and configuration-specific, confirm the insulating-ring variant matches your current build before ordering.
The TEL Focus Ring 380-T6.5 (OEM P/N 3D10-250158-11, ESCT P/N ES7099-083) is an insulating, dielectric edge ring for Tokyo Electron 300 mm plasma etch chambers. It extends the plasma sheath past the wafer rim, shapes the edge electric field through its permittivity, and acts as a sacrificial barrier protecting the electrostatic chuck. As a high-turnover consumable whose erosion directly drives edge-die yield, particle performance and process repeatability, it benefits from dependable second-source supply, accurate dimensions and careful, contamination-free installation. ESCT Fab Support offers it as a new, OEM-compatible part with predictable lead time to keep TEL etch chambers running to specification.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 3D10-250158-11. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
Fill out the form below to request a quote for the part/s you require, making sure to include the OEM part number.
If the part you are looking for is not listed, get in touch and we will try to source it for you through our wide network of partners and suppliers.
We use cookies We use analytics cookies to see how visitors use this site, so we can improve it. They are set only if you accept. Read our Cookie Policy.
