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The Focus Ring 380-T6.5 (TEL OEM P/N 3D10-250157-11) is a consumable edge component used in Tokyo Electron 300 mm plasma etch process chambers. It is an annular ring that seats concentrically around the electrostatic chuck, surrounding the production wafer so that its inner bore frames the wafer edge while its body bridges the gap between the wafer perimeter and the surrounding chamber hardware. In TEL nomenclature, the “380” descriptor corresponds to the ring family and bore geometry sized for a 300 mm wafer footprint, while “T6.5” identifies the nominal ring thickness/height class that sets the standoff between the wafer plane and the surrounding focus-ring surface. The “CP” suffix denotes the specific finished part configuration within that geometry family.
Although it carries no active electronics, the focus ring is one of the most consequential consumables in an etch chamber. It sits directly in the plasma sheath at the wafer edge, where the electric field that accelerates ions toward the wafer is naturally distorted by the transition from wafer to surrounding hardware. By presenting a controlled dielectric or semiconducting surface immediately adjacent to the wafer, the ring “focuses” the sheath so that ions continue to arrive perpendicular to the substrate all the way out to the extreme edge die. Without it, the edge sheath would curve inward, tilting ion trajectories and collapsing etch performance across the outermost millimetres of every wafer.
Because it is sacrificial and erodes under continuous ion bombardment, the focus ring is a scheduled-replacement item with a direct and measurable influence on edge yield. ESCT Fab Support supplies the 380-T6.5 ring as a second-source, OEM-compatible consumable verified to the original form, fit and function so fabs can sustain chamber availability without being constrained to a single supply channel.
The focus ring performs several overlapping electrical, geometric and thermal jobs at the wafer edge simultaneously. Its placement in the plasma sheath means that even small changes in its height, profile or material condition translate into measurable shifts in edge etch behaviour, which is why it is treated as a process-critical consumable rather than a generic mechanical spacer.
A focus ring only delivers value if its material survives sustained plasma exposure while maintaining stable, predictable electrical and dimensional behaviour. The 380-T6.5 is built from a process-matched material specification chosen to balance plasma resistance, low particle generation and the dielectric or semiconducting properties required to shape the edge sheath correctly.
The ring is continuously exposed to energetic ions, reactive radicals and, in many etch recipes, fluorine- or chlorine-bearing chemistries. The material is selected so that it erodes slowly and uniformly rather than pitting, flaking or generating loose particulate, which preserves edge process stability over a long service interval.
The bore concentricity, flatness and the T6.5 thickness class are held to tight tolerances because they directly set the geometric and electrical boundary the wafer edge sees. Material purity and consistent electrical properties keep sheath shaping repeatable from ring to ring and chamber to chamber.
Because the focus ring governs the edge of every wafer processed in the chamber, its condition propagates directly into device-level results. A ring that is correctly specified and within its wear window protects the most vulnerable die; one that is worn, mismatched or damaged silently erodes edge yield.
As a sacrificial part, the focus ring is expected to wear; the engineering objective is to understand how it wears so it can be replaced at the best point rather than too early or too late.
The dominant wear mode is gradual thinning as ion bombardment sputters material from the upper surface. As the ring drops below its designed T6.5 standoff, the edge sheath sags and edge CD walks, which is the usual trigger for scheduled replacement once recipe limits are reached.
Thermal cycling between hot plasma operation and cool idle states, combined with rough handling during preventive maintenance, can initiate cracks or edge chips. These create immediate particle sources and disturb the local sheath, so a chipped ring must be retired regardless of remaining thickness.
Non-uniform erosion roughens the surface and polymer or by-product films can build up on the ring. Both alter the effective electrical surface and can later release as flakes, degrading defect performance and contributing to recipe drift before any obvious dimensional limit is hit.
Focus-ring replacement is a routine preventive-maintenance activity, but because the ring sits on the electrostatic chuck and directly affects edge process, it must be carried out with care and followed by verification. The steps below summarise good practice; always defer to the site-specific TEL maintenance procedure and safety requirements.
Focus rings are high-turnover consumables, so supply continuity and predictable cost matter as much as the part itself. Sourcing the 380-T6.5 through ESCT Fab Support gives engineering and procurement teams a qualified alternative that supports uptime without compromising on edge-process integrity.
It sits around the wafer on the electrostatic chuck and shapes the plasma sheath at the wafer edge. By extending the sheath outward past the wafer perimeter, it keeps ion trajectories vertical at the extreme edge so that edge die etch with the same critical dimension, profile and rate as die in the centre of the wafer.
No. This is a second-source, OEM-compatible focus ring supplied new. It is not an original Tokyo Electron part and is not sold as one. It is manufactured and verified to match the form, fit and function of TEL OEM P/N 3D10-250157-11 so it can be used as a direct replacement in the applicable 300 mm etch chambers.
“380” identifies the ring geometry family sized for the 300 mm wafer footprint, and “T6.5” denotes the nominal thickness/height class that sets the wafer-to-ring standoff governing edge sheath shaping. “CP” designates the specific finished configuration of the part within that family.
Replacement is usually driven by accumulated process time or RF hours per the chamber’s preventive-maintenance plan, confirmed by measured height loss and any drift in edge CD, uniformity or particle counts. A cracked, chipped or heavily roughened ring should be retired immediately regardless of remaining thickness.
Because it is verified to the original form, fit and function, it is intended to behave equivalently to the part it replaces. As with any consumable change, best practice is to season the chamber and run your standard edge CD, uniformity and particle qualification before returning to production.
The current quoted lead time is 4–5 weeks. Building this into your consumable forecasting and holding appropriate buffer stock helps keep focus rings on hand for scheduled preventive maintenance across your TEL etch fleet.
The Focus Ring 380-T6.5 (TEL OEM P/N 3D10-250157-11, ESCT P/N ES7099-082) is a sacrificial edge consumable that shapes the plasma sheath at the wafer perimeter in Tokyo Electron 300 mm etch chambers. Its bore geometry and T6.5 thickness class set the boundary condition that keeps ion trajectories vertical at the edge, directly protecting edge CD, uniformity and particle performance. Made from a plasma-resistant material and held to tight dimensional tolerances, it wears predictably through erosion and is replaced on a planned interval. Supplied new by ESCT Fab Support as a verified OEM-compatible alternative with a 4–5 week lead time, it offers fabs a dependable second source for one of the most yield-critical consumables in the etch chamber.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 3D10-250157-11. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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