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The TEL Focus Ring 380-T4.0, designated by Tokyo Electron under part number 3D10-250177-12, is a precision-machined annular consumable that surrounds the 300 mm wafer at the cathode plane inside a TEL plasma etch process chamber. The “380” in the part designation reflects the ring family dimensioning associated with the 300 mm (Ø380 mm class) electrode assembly, while the “T4.0” denotes the nominal thickness profile of the ring band, and the “(CP)” suffix identifies the controlled process or coated/processed material variant. As a focus ring, this component sits immediately outboard of the wafer edge and is one of the most consumed and most performance-critical parts in the entire etch reactor.
In a TEL 300 mm etcher, the focus ring performs the deceptively simple but electrically central job of extending the plasma sheath uniformly across the wafer edge. Without it, the sheath would terminate abruptly at the wafer perimeter, bending the ion trajectories and producing tilted, tapered or non-uniform features in the outermost dies. By presenting a sacrificial dielectric or semiconducting surface at the same height and electrical character as the wafer, the 380-T4.0 ring effectively makes the plasma behave as though the wafer were larger than it physically is, so the edge exclusion zone shrinks and more die per wafer fall inside specification.
Because it is directly exposed to energetic ions, radicals and process by-products, the focus ring erodes over time and is treated as a scheduled consumable. The ES7099-039 from ESCT Fab Support is offered as a second-source NEW part, dimensionally and electrically matched to the TEL 3D10-250177-12 so that fabs can maintain edge yield without being constrained to a single supply channel.
The focus ring is not merely a mechanical spacer; it is an active participant in the electrostatics and gas dynamics at the wafer edge. Its profile, thickness and material resistivity all couple into how the sheath wraps around the last few millimetres of the wafer. The 380-T4.0 ring contributes to the etch process in several interlocking ways:
Focus rings for TEL 300 mm etchers are produced from carefully selected, plasma-resistant materials whose resistivity and erosion behaviour are matched to the process chemistry. The 380-T4.0 (CP) variant is a controlled-process consumable: its surface condition, dimensional tolerance and bulk material are specified to reproduce the original part’s electrical and erosion signature.
Depending on the specific recipe the ring serves, focus rings in this class are commonly fabricated from high-purity silicon, silicon carbide or a comparable plasma-grade material that erodes predictably and contributes minimal metallic contamination. The material’s electrical resistivity is a deliberate design choice because it sets how the ring couples RF and how the sheath terminates at the wafer edge.
The T4.0 thickness band, inner-diameter step and flatness of the ring are held to tight tolerances because even tens of microns of variation shift the sheath height relative to the wafer surface. Surface finish is equally important, as roughness and microstructure govern both particle release and the rate at which the ring erodes into a sloped step over its service life.
Because the focus ring acts on the wafer perimeter, where a disproportionate number of die reside, its condition has an outsized influence on overall fab economics. A worn or out-of-spec ring shows up first as edge yield loss, then as drifting process control across the whole wafer:
As a front-line consumable, the focus ring fails in characteristic, well-understood ways. Recognising the dominant mode in a given chamber helps the integration and equipment teams set the right replacement cadence.
The most common mode is gradual erosion of the top surface and inner step under continuous ion bombardment. As the ring thins, the sheath height drops relative to the wafer and edge etch behaviour drifts, eventually pushing the outer die out of specification and triggering a scheduled change.
Thermal cycling, mechanical handling and localised hot spots can initiate cracks or chips, particularly once the ring has thinned. A cracked ring is a direct particle source and, in severe cases, can fracture during a cycle and contaminate the chamber or damage the wafer.
Process by-products and polymer can accumulate on and around the ring, altering its effective resistivity and gap. Heavy deposition or a degraded surface can promote micro-arcing at the wafer edge, which both damages the ring and generates defects, signalling that replacement is overdue.
Focus ring replacement is a routine but contamination-sensitive task that should always follow the relevant TEL maintenance procedure and the fab’s own safety and ESD protocols. The following sequence outlines the general approach:
Focus rings are high-frequency consumables, so supply continuity and predictable quality matter as much as the part itself. Sourcing the ES7099-039 through ESCT Fab Support gives fabs a qualified alternative to single-channel procurement while preserving process integrity:
It surrounds the 300 mm wafer at the cathode and extends the plasma sheath beyond the wafer edge, keeping ion trajectories vertical so that edge die etch with the same profile and uniformity as the wafer centre. It also confines the plasma and protects surrounding chamber hardware.
No. This ring is supplied by ESCT Fab Support as a second-source NEW, OEM-compatible part. It is verified to the form, fit and function of TEL P/N 3D10-250177-12 but is not an original Tokyo Electron branded component.
The (CP) suffix identifies the controlled-process material and surface variant of the ring. It signals that the bulk material, surface condition and tolerances are specified to reproduce the electrical and erosion behaviour of the original part rather than a generic blank.
Service life depends entirely on the process chemistry, power and run rate of the chamber, so intervals are set per recipe and tracked by RF hours or wafer count. Replacement is typically triggered when edge uniformity drift, particle counts or measured erosion reach predefined limits.
The standard lead time for this part is 4–5 weeks. Because focus rings are consumed on a predictable cadence, we recommend factoring this into your reorder points and holding appropriate buffer stock to avoid chamber downtime.
The part is built to match the original dimensionally and electrically, but as with any consumable change you should qualify it on a non-production chamber first and confirm edge uniformity against your control limits before releasing it to volume production.
The TEL 380-T4.0 (CP) focus ring, OEM P/N 3D10-250177-12, is a critical edge-confinement consumable in 300 mm TEL plasma etch chambers, directly governing edge die uniformity, plasma confinement and particle performance. Offered by ESCT Fab Support as second-source NEW part ES7099-039, it provides a quality-controlled, form-fit-function alternative to single-source procurement, with a defined 4–5 week lead time to support planned consumable management and sustained edge yield.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 3D10-250177-12. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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