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The Focus Ring 360 is an annular plasma-facing consumable that surrounds the 300 mm wafer at the outer perimeter of the electrostatic chuck in a Tokyo Electron (TEL) plasma etch chamber. Carrying the GES original part number D100-04275S-G06, it is one of the most frequently replaced components in any high-volume etch fleet, because it sits directly in the path of the plasma sheath and ion flux that does the etching. Although it is a passive part with no moving elements, its geometry, material and electrical behaviour have an outsized influence on how the wafer’s edge is processed.
In a 300 mm etch chamber, the wafer edge is the hardest region to keep uniform. The focus ring extends the effective process surface beyond the silicon, allowing the plasma sheath to remain flat and the ion trajectories to stay vertical right out to the wafer edge. Without it, the sheath would bend downward at the wafer boundary, tilting incoming ions and degrading critical-dimension (CD) and etch-profile control on the outermost dies. The Focus Ring 360 therefore protects yield on the rings of dies that, on a modern 300 mm wafer, represent a meaningful fraction of total device count.
Because it is sacrificial by design, the focus ring erodes during normal operation and is consumed on a predictable schedule. Maintaining a reliable supply of form-, fit- and function-verified rings such as this 2nd-source new part keeps etch tools available and helps holding edge process windows steady between scheduled wet cleans.
The focus ring performs several electrical and physical jobs simultaneously, all of them aimed at making the edge of the wafer behave as much like the centre as possible. In a TEL 300 mm chamber its principal functions are as follows:
Focus rings for 300 mm etch service are manufactured from plasma-grade materials selected for predictable, low-particulate erosion under aggressive fluorine-, chlorine- or bromine-based chemistries, commonly high-purity silicon, silicon carbide or, in some applications, quartz. The chosen material must erode slowly and evenly rather than spalling or flaking, because the ring’s dimensional change over its lifetime directly shifts the edge electrical environment. High purity is critical to avoid introducing metallic or mobile-ion contamination into the chamber and onto the wafer.
The flatness, inner-diameter step height and concentricity of the ring relative to the wafer are tightly toleranced, because they govern how closely the sheath tracks the wafer plane. As the top surface erodes, the gap between ring height and wafer height grows, the sheath begins to dip at the edge and edge ion energy drifts. Dielectric constant and surface resistivity also matter, since they set the capacitive coupling and RF return at the perimeter. A correctly specified Focus Ring 360 holds these parameters within the same envelope as the original part so that the edge process behaves predictably from installation through end of life.
Because the focus ring controls the edge plasma directly, its condition is one of the dominant levers on edge yield and tool-matching performance. A worn, cracked or out-of-spec ring produces effects that propagate straight into device parametrics and fab economics:
The dominant wear mechanism is steady recession of the top surface under continuous ion bombardment. As the ring thins, the step relationship to the wafer changes, the sheath sags at the edge and edge ion energy falls. This is expected and predictable, which is why focus rings are tracked by accumulated RF hours and replaced on a fixed schedule before edge performance drifts out of specification.
Repeated thermal cycling, localised hot spots and mechanical stress at the seating surface can initiate cracks, particularly in brittle ceramic and silicon materials. A cracked ring can shift its electrical behaviour abruptly, generate large particles, or in severe cases fragment and damage the chuck. Any visible crack or chip is cause for immediate replacement.
Towards end of life, the eroded surface roughens, deposits accumulate and the ring begins to shed micro-particles that land on the wafer as killer defects. Polymer build-up and flaking from cumulative deposition further increase particle risk, making particle performance one of the clearest signals that the ring has reached the end of its useful service window.
Focus ring replacement is a routine preventive-maintenance task, but it must be carried out cleanly and precisely because seating and concentricity directly affect edge results. The following sequence reflects good practice; always follow the applicable TEL maintenance procedure and your fab’s safety rules:
Focus rings are consumed continuously, so supply reliability is as important as the part itself. ESCT Fab Support helps fabs hold edge process windows stable and keep etch tools available without over-committing to single-source pricing:
It surrounds the 300 mm wafer at the edge of the electrostatic chuck and extends the plasma sheath beyond the wafer so that ion trajectories stay vertical at the perimeter. This keeps edge etch rate, profile and critical dimension uniform with the rest of the wafer, while also providing an RF return path and shielding the chuck from the plasma.
No. This is a 2nd-source new part supplied as an OEM-compatible equivalent to GES P/N D100-04275S-G06. It is a brand-new, unused component verified to the form, fit and function of the original, but it is not an original OEM part and is not sold as one.
Service life depends on the process chemistry, RF power and duty cycle, so it is best tracked by accumulated RF hours rather than calendar time. Most fabs establish a fixed replacement interval based on monitored erosion and edge-uniformity drift, and replace the ring proactively before it falls out of specification.
Typical indicators are measurable height loss, drifting edge critical dimension or etch-rate uniformity, rising particle counts on monitor wafers, and any visible cracks, chips or surface roughening. Reaching the scheduled RF-hour limit is also a standard trigger for replacement.
The current lead time is approximately 4 to 5 weeks. Because focus rings are consumed continuously, we recommend ordering against your planned-replacement schedule and holding appropriate safety stock so a tool is never waiting on an edge consumable.
When the ring is manufactured to the correct material and dimensional specification and installed with proper seating and concentricity, it reproduces the established edge electrical environment, supporting consistent chamber-to-chamber matching. We recommend qualifying the part in your process and confirming edge uniformity on monitor wafers before broad fleet rollout.
The Focus Ring 360 (GES P/N D100-04275S-G06) is a sacrificial edge ring for Tokyo Electron 300 mm plasma etch chambers, responsible for extending and shaping the plasma sheath at the wafer perimeter, providing an edge RF return path and protecting the electrostatic chuck. Its material purity, dimensional tolerances and electrical properties govern edge critical dimension, etch uniformity and particle performance, making it one of the most yield-sensitive consumables in the etch module. Supplied by ESCT Fab Support as a 2nd-source new part on a roughly 4 to 5 week lead time, it offers a verified, cost-effective alternative to single-source supply for fabs managing continuous focus-ring consumption.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of GES part number D100-04275S-G06. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with GES, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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