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The TEL Focus Ring 360-302-C is a consumable plasma-facing ring that surrounds the wafer at the outer edge of the electrostatic chuck (ESC) inside a Tokyo Electron 300 mm plasma etch process chamber. Sitting concentrically around the 300 mm wafer, the focus ring extends the conductive and dielectric surface of the chuck assembly beyond the wafer perimeter so that the plasma sheath does not collapse or distort at the wafer edge. In doing so it directly governs how etch behaves across the outermost few millimetres of the substrate, one of the most yield-sensitive regions of any device wafer.
In TEL etch platforms, the focus ring is one of a stacked family of edge consumables that work together: the focus ring, the surrounding insulator or cover ring, and the underlying electrode hardware. Because it is exposed continuously to energetic ions and reactive radicals, the 360-302-C is treated as a scheduled-replacement item rather than a permanent component. Its condition, thickness and seating all feed directly into edge etch rate, sidewall profile and within-wafer uniformity.
This ESCT Fab Support listing covers the 360-302-C focus ring as a form-, fit- and function-compatible replacement for TEL OEM part number 3D10-201448-21, carried under ESCT part number ES7099-025. It is intended for engineers and procurement teams maintaining TEL 300 mm etch chambers who need reliable edge-ring availability without being locked solely to single-source OEM supply.
The primary job of the focus ring is to shape and confine the plasma sheath at the wafer edge so that ions arrive at the substrate perimeter with the same trajectory and energy they have over the wafer centre. Without a correctly profiled ring, the electric field bends at the wafer edge, ion paths tilt, and the outer die etch with a skewed profile. The 360-302-C performs several interlinked functions within the chamber:
Focus rings for TEL etch chambers are manufactured from process-matched consumable materials chosen for their behaviour under sustained plasma exposure. The 360-302-C is supplied in a material specification compatible with the original part, so that its erosion characteristics, electrical properties and contamination profile match what the recipe was tuned around.
Etch focus rings are typically produced from high-purity silicon, silicon carbide or quartz-class materials depending on the chamber and process chemistry. The objective is a low-contamination, erosion-tolerant surface that wears predictably rather than catastrophically. Key material attributes include:
Because the ring forms part of the RF boundary at the wafer edge, its electrical properties matter as much as its mechanical fit. The material’s conductivity or dielectric constant influences how the sheath terminates at the wafer perimeter and how RF return paths behave near the chuck. A compatible ring preserves the intended edge coupling, which is critical for the following:
The focus ring’s condition translates almost directly into edge-of-wafer yield. As the ring erodes, its step height drops, the sheath geometry at the wafer edge shifts, and the outer die begin to drift away from process targets. A worn or incorrectly seated 360-302-C therefore has measurable, costly consequences:
Focus rings fail through wear rather than sudden breakage in normal service, but several distinct degradation patterns drive replacement decisions.
Continuous ion bombardment slowly thins the ring, particularly along the step that faces the plasma. As the step height falls, the sheath at the wafer edge sinks, ion angles tilt and edge etch results progressively degrade. This is the dominant, expected wear mode and the primary reason for scheduled replacement.
Thermal cycling, mechanical handling and localised thinning can lead to surface cracking or edge chipping. Once a ring begins to crack or flake, it becomes a particle source that contaminates wafers and can scatter debris across the chuck, forcing an immediate swap and chamber clean.
A ring that is not seated flat (because of debris under the ring, a damaged contact surface or incorrect installation) distorts the local sheath and creates an asymmetric edge response. Surface contamination or polymer build-up between PM intervals can similarly alter electrical behaviour and trigger uniformity excursions.
Focus ring replacement is a routine preventive-maintenance task on TEL etch chambers, but cleanliness and correct seating are critical to restoring edge performance. The following sequence reflects good practice; always follow the applicable TEL maintenance procedure and your fab’s safety protocols for the specific chamber.
Focus rings are high-frequency consumables, and edge-ring availability can become a constraint on chamber uptime if supply depends on a single source. Stocking compatible rings such as the ES7099-025 lets fabs protect their PM cadence and avoid holding tools off-line waiting for parts. ESCT Fab Support offers several advantages for teams managing TEL etch consumables:
It surrounds the 300 mm wafer at the edge of the electrostatic chuck and shapes the plasma sheath so that ions strike the wafer perimeter with the correct angle and energy. This keeps edge etch profiles vertical and maintains within-wafer uniformity, while acting as a sacrificial surface that protects the electrode beneath it.
No. The ES7099-025 is supplied as a new, second-source part that is OEM-compatible. It is manufactured and verified to match the form, fit and function of TEL OEM P/N 3D10-201448-21, but it is not an original Tokyo Electron branded component.
Replacement intervals depend on the process chemistry, RF power and total etch hours, so they are set by each fab’s preventive-maintenance data rather than a fixed figure. Most sites monitor step-height loss and edge uniformity trends and replace the ring when erosion approaches the limit at which edge performance begins to drift.
As the ring erodes, edge critical dimensions drift, sidewalls tilt and within-wafer uniformity degrades, reducing yield on the outer die. Advanced wear can also generate particles and accelerate erosion of the underlying electrode, turning a low-cost consumable replacement into a more expensive repair.
The typical lead time is 4-5 weeks. Because focus rings are consumed on a regular cadence, we recommend ordering against your PM schedule and holding buffer stock so chamber maintenance is never gated by part availability.
The most reliable cross-reference is the TEL OEM part number 3D10-201448-21, which this ESCT P/N ES7099-025 is matched to. Confirm that your chamber currently uses that OEM part number, and our team can help verify compatibility before you order.
The TEL Focus Ring 360-302-C (ESCT P/N ES7099-025, matched to OEM P/N 3D10-201448-21) is a plasma-facing edge consumable that confines the sheath and controls ion trajectories at the wafer perimeter in Tokyo Electron 300 mm etch chambers. Its material purity, dimensional accuracy and electrical behaviour govern edge etch uniformity, particle performance and outer-die yield, while it serves as a sacrificial barrier protecting the chuck and electrode. Supplied as a new, second-source, OEM-compatible ring with a 4-5 week lead time, it gives fabs a dependable way to protect their preventive-maintenance cadence and edge-of-wafer process control.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 3D10-201448-21. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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