OEM P/N:
ESCT P/N:
PART TYPE:
OEM:
The TEL focus ring identified as 360-302-C is a circular edge consumable that surrounds the 300 mm wafer inside a Tokyo Electron plasma etch process chamber. It sits on the electrostatic chuck (ESC) periphery, hugging the outer edge of the wafer so that the plasma sheath, electric field lines and ion trajectories are extended smoothly beyond the wafer edge rather than collapsing abruptly at it. In doing so, the ring “focuses” the etch field across the last few millimetres of usable silicon, the precise region where edge die yield is won or lost.
In a 300 mm etch flow, the wafer edge is the most difficult zone to keep uniform. Without a properly dimensioned and electrically matched focus ring, the sheath bends inward over the bevel, ion incidence angle tilts and etch features at the periphery skew or tilt. The 360-302-C is engineered to present a consistent dielectric and topographic environment to the plasma so that edge etch rate, profile angle and critical dimension track the rest of the wafer. Because it is directly in the path of energetic ions and reactive radicals, it is treated as a scheduled consumable rather than a permanent assembly.
This listing covers the 360-302-C focus ring (TEL OEM P/N 3D10-201448-13), supplied under ESCT P/N ES7099-090 as a second-source new component verified to the original form, fit and function. It is intended for engineers maintaining TEL 300 mm etch chambers who need a dependable, cost-controlled replacement for a part that is consumed by normal production.
The focus ring performs several interdependent jobs at the wafer edge, all of them aimed at making the periphery of the wafer behave electrically and chemically like its centre. Its geometry, height and material properties are chosen to keep the plasma sheath flat and the ion flux vertical right out to the wafer bevel.
Focus rings for TEL 300 mm etch chambers are produced from high-purity consumable materials (typically silicon, quartz or comparable dielectric/semiconductor grades) selected to erode in a controlled, predictable manner while keeping the process environment clean.
Beyond raw material grade, the ring’s thickness, inner diameter and seating geometry are critical because they set how the sheath sits over the wafer edge. A correctly matched ring keeps edge behaviour in line with the recipe it was qualified against.
Because the focus ring governs the most marginal region of the wafer, its condition has an outsized influence on edge die yield and on overall process stability. As the ring erodes and its profile changes, edge results drift well before any obvious fault is flagged.
The dominant failure mode is gradual erosion. Continuous ion bombardment thins the ring and rounds its inner edge, lowering its effective height. As that height drops, the sheath alignment over the wafer edge shifts and edge etch results creep out of specification, which is why height and step depth are tracked as wear indicators.
Repeated thermal cycling and mechanical handling can crack or chip a brittle dielectric ring, especially at the inner edge or seating face. Cracks compromise the RF path and can release particles into the chamber; a chipped or fractured ring should be replaced immediately rather than run to a wear limit.
Polymer and by-product films accumulate on the ring surface over time. If this build-up is uneven or begins to flake, it perturbs the local field and becomes a particle source, so deposition condition is assessed at every preventive-maintenance window alongside dimensional wear.
The focus ring is changed during scheduled preventive maintenance on a vented, cooled chamber. Follow TEL procedures and your site safety rules at every step; the notes below summarise the typical sequence.
Focus rings are high-turnover consumables, so holding qualified stock is central to keeping etch chambers productive. Sourcing them through ESCT Fab Support gives maintenance teams a controlled-cost alternative to single-source OEM supply without compromising on fit or process behaviour.
It surrounds the 300 mm wafer at the edge of the electrostatic chuck and extends the plasma sheath and electric field beyond the wafer edge. This keeps ion trajectories vertical and etch results uniform across the outermost die, while also protecting the chuck periphery from plasma erosion.
No. This is a second-source new part supplied under ESCT P/N ES7099-090 and cross-referenced to TEL OEM P/N 3D10-201448-13. It is a new OEM-compatible component verified to form, fit and function, but it is not an original OEM part.
Replacement interval depends on your etch chemistry, RF power and duty cycle. In practice the ring is changed when its height, profile or surface condition drift past your qualified wear limits, usually at a scheduled preventive-maintenance window rather than on a fixed calendar date.
Typical indicators are reduced ring height, a rounded or recessed inner edge, edge critical-dimension or profile drift on monitor wafers, rising particle counts at the wafer edge, and any visible cracking, chipping or uneven deposition build-up.
The typical lead time is 4-5 weeks. Because focus rings are consumed continuously in production, we recommend ordering ahead of need and holding buffer stock so a chamber is never held up waiting on an edge consumable.
The part is manufactured to the original dimensional and material specification so that it behaves like the ring your recipe was qualified against. As with any consumable change, we advise running your standard edge-sensitive qualification wafers after installation to confirm performance before full production.
The TEL 360-302-C focus ring (OEM P/N 3D10-201448-13, ESCT P/N ES7099-090) is a precision edge consumable for Tokyo Electron 300 mm plasma etch chambers. By extending the plasma sheath and electric field beyond the wafer edge, it preserves edge etch uniformity, protects the chuck periphery and directly supports edge die yield. Because it erodes in normal use, it must be inspected and replaced on a planned schedule. Supplied as a second-source new part verified to form, fit and function with a typical 4-5 week lead time, ES7099-090 gives TEL etch teams a cost-effective, qualification-ready way to keep this critical consumable in stock.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 3D10-201448-13. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
Fill out the form below to request a quote for the part/s you require, making sure to include the OEM part number.
If the part you are looking for is not listed, get in touch and we will try to source it for you through our wide network of partners and suppliers.
