ELECTRODE (TEST)

PART DETAILS

3D10-250316-11(S)
ELECTRODE (TEST)

OEM P/N: 

3D10-250316-11(S)

ESCT P/N: 

N/A

PART TYPE:

2nd Source NEW

OEM: 

NEST
MORE INFO

NEST test cathode electrode (OEM P/N 3D10-250316-11(S)), plasma-facing cathode assembly for Tokyo Electron 300 mm etch systems

OEM-compatible cathode electrode supplied 2nd source NEW by ESCT Fab Support

The NEST Test Cathode Electrode, OEM part number 3D10-250316-11(S), is a plasma-facing cathode component used in Tokyo Electron (TEL) 300 mm plasma etch process chambers. As a cathode-class part, it forms part of the powered electrode stack at the base of the chamber, where it sits beneath or adjacent to the electrostatic chuck assembly and helps establish the radio-frequency (RF) field that sustains the plasma and accelerates ions towards the wafer surface. The “(TEST)” designation in the part name reflects its provenance as a characterisation or qualification-grade electrode, a part used to validate chamber behaviour and electrode geometry, but it is supplied here as a fully functional cathode of the same form, fit and function as the production component.

In a capacitively coupled etch reactor, the cathode is the electrode through which RF power is delivered into the plasma. The wafer rests above it, and the sheath voltage developed across the cathode determines the energy and directionality of the ions bombarding the wafer. Because this electrode is directly exposed to the plasma and to continuous ion impact, it is treated as a consumable in fab maintenance planning: its surface condition, flatness and electrical contact integrity all degrade over time and must be restored on a defined preventive maintenance cycle.

For fabs running TEL 300 mm etch platforms, securing a reliable, qualified source of cathode electrodes protects tool availability and edge-to-edge process uniformity. ESCT Fab Support offers this electrode as a second-source new part, providing an OEM-compatible alternative that minimises dependence on a single supply channel while preserving the dimensional and electrical characteristics the chamber requires.

Functional role of the cathode electrode in NEST and TEL etch platforms

The cathode electrode is one of the most electrically and thermally critical surfaces in a plasma etch chamber. It is responsible for coupling RF energy into the discharge while simultaneously defining the lower boundary of the plasma volume that processes the wafer. Within the TEL 300 mm chamber, the electrode performs several interlocking functions:

  • Delivers RF power into the plasma, establishing the cathode sheath that accelerates ions vertically towards the wafer for anisotropic etching.
  • Defines the lower electrical boundary of the discharge, working with the upper electrode and chamber walls to set the overall plasma impedance.
  • Provides a low-resistance RF return path so that current flows uniformly across the wafer area without localised hot spots.
  • Maintains a flat, planar surface that keeps the sheath uniform from wafer centre to edge, supporting consistent etch rate and profile.
  • Helps anchor the thermal interface beneath the wafer support, contributing to predictable wafer temperature control during processing.
  • Serves, in its test configuration, as a reference electrode for verifying chamber matching, RF behaviour and electrode-to-wafer geometry during qualification.

Material and process performance

A cathode electrode must combine electrical conductivity, plasma resistance and dimensional stability under continuous thermal and ion loading. Its performance is judged on how well it holds those properties across thousands of RF hours.

Conductivity and plasma resistance

The electrode material is selected to carry RF current with minimal loss while withstanding sustained ion bombardment without excessive erosion or particle generation. Surface finish and bulk conductivity are tightly controlled so that the sheath develops uniformly across the full electrode face.

  • High electrical conductivity to minimise RF losses and localised heating.
  • Resistance to physical sputtering and chemical attack from reactive etch chemistries.
  • Low intrinsic particle shedding to protect wafer defect performance.
  • Controlled surface finish to maintain a predictable, repeatable sheath.

Dimensional and thermal stability

Flatness and thickness tolerances directly govern sheath uniformity and the electrode-to-wafer gap. The part must hold its geometry as it cycles repeatedly between ambient and process temperature.

  • Tight flatness and parallelism to keep the plasma sheath even across the wafer.
  • Stable thickness to preserve the designed electrode-to-wafer spacing.
  • Low thermal distortion across repeated process and idle cycles.
  • Consistent mating-surface geometry for reliable RF and thermal contact.

Impact on tool performance and yield

Because the cathode shapes the electric field that drives the etch, its condition feeds directly into the metrics fabs care about most, uniformity, repeatability and defectivity. A worn, contaminated or poorly seated electrode can quietly erode yield long before it triggers a hard fault.

  • Etch-rate uniformity from wafer centre to edge depends on a flat, evenly conducting electrode surface.
  • Profile control and critical-dimension consistency rely on a stable, well-defined cathode sheath.
  • Particle and defect counts rise sharply when the electrode surface begins to erode or flake.
  • RF stability and impedance matching degrade if electrical contact at the electrode interface deteriorates.
  • Chamber-to-chamber matching across a fleet of tools is harder to sustain with inconsistent electrode condition.
  • Unplanned electrode failure can force an unscheduled wet clean and requalification, costing substantial tool time.

Common wear and failure modes

Surface erosion and sputtering

Continuous ion bombardment gradually erodes the electrode face, roughening the surface and changing its local geometry. As erosion progresses, the sheath becomes less uniform, etch rate drifts, and the electrode begins shedding particles that land on wafers as defects.

Contact and RF path degradation

The electrical interface between the cathode and the RF feed can loosen or oxidise over time, raising contact resistance. This produces localised heating, unstable impedance matching and RF reflected-power excursions that show up as process drift and tool alarms.

Thermal fatigue and deposit build-up

Repeated heating and cooling cycles stress the electrode and any bonded or mated interfaces, and reaction by-products accumulate as polymer or residue films. Build-up alters the effective electrode surface and, if it flakes, becomes a direct source of particulate contamination.

Installation and replacement guidance

Replacing a cathode electrode is a precision task carried out under cleanroom discipline and in line with the tool owner’s preventive maintenance procedures. The sequence below outlines a typical approach; always follow the equipment manufacturer’s documented method and safety requirements.

  • Vent the chamber, confirm RF and high-voltage lockout, and allow the assembly to cool to a safe handling temperature.
  • Remove the upper hardware and any surrounding consumables needed to access the electrode, recording their order and orientation.
  • Detach the existing cathode electrode, inspecting its contact surfaces and the underlying interface for erosion, residue or damage.
  • Clean the mating surfaces and RF contact area to bare, particle-free condition using approved cleanroom materials.
  • Fit the new electrode using clean, gloved handling, with correct seating, orientation and flatness against the mating interface.
  • Reinstall surrounding hardware and torque fasteners evenly to specification to guarantee uniform RF and thermal contact.
  • Pump down, leak-check, season the chamber and run qualification wafers to confirm uniformity, RF stability and particle performance before returning to production.

Spare parts strategy for NEST and TEL etch consumables

Cathode electrodes are recurring-replacement items, so a sound spares strategy treats them as planned consumables rather than emergency purchases. Sourcing through ESCT Fab Support gives engineering and procurement teams a dependable, qualified channel for these parts.

  • Second-source new parts that reduce single-supplier dependency for critical etch consumables.
  • Verified form, fit and function to maintain compatibility with TEL 300 mm etch chambers.
  • Predictable lead times that support planned preventive maintenance scheduling.
  • Support for consignment and buffer-stock arrangements to protect tool uptime.
  • Knowledgeable technical support to help match the correct electrode to your chamber configuration.

Frequently asked questions

What does this cathode electrode do in the chamber?

It is the powered electrode that couples RF energy into the plasma and establishes the sheath that accelerates ions towards the wafer. Its surface condition and flatness directly influence etch uniformity, profile control and particle performance.

Is this an original OEM part?

No. This electrode is supplied as a second-source new, OEM-compatible part. It is not an original OEM component, but it is built and verified to match the form, fit and function of OEM part number 3D10-250316-11(S) for use in the corresponding TEL 300 mm etch chambers.

What does the “(TEST)” designation mean?

The designation reflects the electrode’s origin as a characterisation or qualification-grade part used to validate chamber behaviour and electrode geometry. It is supplied here as a fully functional cathode of equivalent form, fit and function.

How long does the cathode electrode last?

Service life depends on process chemistry, RF power, duty cycle and cleaning regime, so it is best defined by RF hours or wafer count tracked against your own preventive maintenance data rather than a fixed calendar interval.

What is the lead time for this part?

The typical lead time is approximately 4 to 5 weeks. We recommend holding buffer stock or placing scheduled orders to align deliveries with your planned maintenance windows and protect tool availability.

How can I confirm this is the correct electrode for my tool?

Match the OEM part number 3D10-250316-11(S) against your chamber’s bill of materials and current configuration. Our technical team can help verify compatibility with your specific TEL 300 mm etch chamber before you order.

Summary

The NEST Test Cathode Electrode (OEM P/N 3D10-250316-11(S)) is a plasma-facing cathode for Tokyo Electron 300 mm plasma etch chambers, responsible for coupling RF power into the discharge and defining the sheath that drives anisotropic etching. As a continuously eroded consumable, its flatness, conductivity and contact integrity govern etch uniformity, RF stability and particle performance, making proactive replacement central to sustained yield. Supplied by ESCT Fab Support as a second-source new, OEM-compatible part with a typical 4 to 5 week lead time, it gives fabs a dependable alternative source for maintaining etch-chamber performance.

Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Nest part number 3D10-250316-11(S). It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Nest, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.

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