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The CL380-364-0.5 (PH) V2 cathode is a high-purity silicon electrode used in Tokyo Electron (TEL) 300 mm plasma etch process chambers. Carrying TEL OEM part number 2L10-250520-11 and supplied under ESCT part number ES7099-059, this component is the driven electrode surface that sits directly in the active plasma region of a capacitively-coupled etch chamber. The “CEL” designation identifies it as a cathode electrode plate, while the V2 suffix denotes a specific revision of the electrode geometry and the “(PH)” code reflects a defined surface finish and through-feature configuration.
Within the chamber stack, the cathode electrode is one of the most electrically and chemically demanding consumables. It conducts RF energy into the process gas to strike and sustain the plasma, it is continuously bombarded by accelerated ions, and on many TEL etch architectures it is also perforated to act as a gas distribution surface that meters reactant flow across the wafer. Because it is fabricated from semiconductor-grade silicon, the electrode itself is gradually consumed during processing, which is precisely why it is treated as a scheduled-replacement consumable rather than a permanent assembly.
The condition of this cathode has a direct, measurable bearing on etch rate, within-wafer uniformity, plasma stability and particle performance. A worn, cracked or contaminated electrode is one of the most common root causes of drift in critical-dimension control and of unexplained particle excursions, making it a part that process and equipment engineers monitor closely across the consumable lifecycle.
The cathode electrode performs several overlapping duties simultaneously, combining an electrical, a chemical and a gas-handling function in a single silicon plate. In a TEL capacitively-coupled etch chamber its principal roles include the following.
The electrode is machined from high-resistivity, semiconductor-grade silicon precisely because the material participates in the etch chemistry. As the plasma erodes the silicon surface, it releases silicon that helps regulate free fluorine and supports the passivation and polymer balance that defines selectivity and profile control.
The defined surface finish and the precision of any gas-feed perforations are central to how this V2 electrode behaves. Surface roughness influences plasma anchoring and particle generation, while hole diameter, pitch and edge quality govern how evenly gas is metered across the 300 mm wafer.
Because the cathode is simultaneously an RF electrode, a chemistry source and often a gas-distribution surface, its condition propagates directly into the metrics that determine device yield. The consequences of running an out-of-specification or end-of-life electrode include the following.
The most fundamental wear mechanism is gradual consumption of the silicon by ion bombardment and chemical attack. As the electrode thins, its impedance, gap and silicon-loading contribution all change, and at a certain point the surface no longer supports the stable, uniform plasma the recipe was qualified against.
Silicon is strong but brittle, so repeated thermal cycling, RF stress and improper handling or clamping can initiate cracks. A cracked electrode is a serious failure: it can shed particles, distort the local electric field, cause arcing and, in the worst case, fracture during processing.
Where the electrode carries gas-feed holes, those features erode preferentially and can enlarge or develop rough edges over time, altering local gas conductance. Conversely, polymer and by-product deposition can partially occlude features or build up on the surface, both of which skew flow distribution and feed particle excursions.
Cathode replacement should be carried out by trained personnel following the relevant TEL maintenance procedures and the host fab’s safety and contamination controls. The general sequence is as follows.
Silicon cathodes are scheduled-replacement consumables, so keeping qualified spares on hand protects tool availability. ESCT Fab Support helps fabs maintain that buffer with reliable, cost-effective sourcing.
It is a high-purity silicon cathode electrode for TEL 300 mm plasma etch chambers. It is the RF-driven electrode surface that strikes and sustains the plasma, contributes silicon to the etch chemistry and, where configured, distributes process gas across the wafer.
No. This is a 2nd source, new part supplied by ESCT Fab Support. It is not an original OEM part and is not sold as such; it is a new, OEM-compatible electrode verified to match the form, fit and function of TEL P/N 2L10-250520-11.
Because the electrode is consumed during etching, its silicon enters the chamber environment and the wafer’s near-surface region. High purity minimises metallic and mobile-ion contamination and keeps the silicon-loading contribution to plasma chemistry stable and predictable.
Replacement is usually driven by accumulated RF hours or wafer count against the qualified consumable life, supported by trends in etch rate, uniformity and particle data. Visible thinning, cracking, enlarged perforations or rising defectivity are clear indicators to schedule a change.
V2 identifies a specific revision of the electrode geometry and configuration. It is important to match the revision used in your chamber, as differences in features or dimensions can affect plasma behaviour and process matching. Confirm your installed configuration before ordering.
The typical lead time is 4-5 weeks. Because the cathode is a scheduled consumable, we recommend holding qualified spares aligned to your replacement interval so that a planned change never has to wait on procurement.
The CL380-364-0.5 (PH) V2 silicon cathode (TEL OEM P/N 2L10-250520-11, ESCT P/N ES7099-059) is a critical RF electrode consumable for TEL 300 mm plasma etch chambers. It couples power into the plasma, contributes silicon to the etch chemistry and helps shape gas and ion distribution across the wafer, directly influencing etch uniformity, critical-dimension control and particle performance. Erosion, cracking and feature wear make it a scheduled-replacement item, and ESCT Fab Support supplies it as a new, OEM-compatible electrode verified to form, fit and function, with a typical 4-5 week lead time to support proactive spares planning.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Tokyo Electron part number 2L10-250520-11. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Tokyo Electron, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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