OEM P/N:
ESCT P/N:
PART TYPE:
OEM:
The Gripper Finger (AMAT OEM P/N 0020-85167) is a precision wafer-edge clamping element used within Applied Materials ion implanter platforms to capture, restrain and locate a wafer during transfer and processing. The “short, extended” geometry describes a finger of a defined reach and contact profile, while “non-conductive” denotes that this variant is fabricated from an insulating material rather than a metallic or coated-metal body. In an environment dominated by high-energy ion beams, electrostatic clamping potentials and floating wafer surfaces, the choice of a dielectric finger is a deliberate engineering decision rather than an incidental material substitution.
Gripper fingers operate at the mechanical interface between the wafer handling robotics and the wafer itself. Several fingers act together as a set, each making contact only at the extreme edge or bevel of the wafer so that the active device area is never touched. They sit on the gripper jaw, end-effector or platen-edge mechanism, and they are among the components most directly responsible for keeping a wafer flat, centred and stationary while it is shuttled through the load chain or held against the implant station.
Because this finger is non-conductive, it serves a dual purpose: it grips the wafer and it electrically isolates the wafer edge from the surrounding grounded or biased metalwork. That isolation matters in an implanter, where the wafer can carry an accumulated charge from the beam and where uncontrolled discharge paths can damage devices or perturb dose measurement. As a small, high-wear consumable in direct contact with every wafer that passes through the tool, the gripper finger has an outsized influence on handling reliability, particle performance and ultimately on yield.
Within the wafer handling subsystem, the gripper finger performs the physical task of holding the wafer while electrically and mechanically protecting it. Its short, extended profile is matched to a specific jaw position and clamping travel so that the contact point lands consistently on the wafer edge exclusion zone. The core functions of this part include the following:
As a non-conductive consumable in repeated contact with silicon, the gripper finger must satisfy two competing demands: it must be soft and compliant enough to grip without damaging the wafer, yet stable and durable enough to keep its dimensions and isolation properties over thousands of clamping cycles.
The insulating body breaks the electrical path between the wafer and the metal jaw, which matters where charge accumulates on the wafer surface under the beam. The material is selected for low outgassing and low ionic contribution so that it is compatible with vacuum and does not introduce mobile-ion contamination at the wafer edge.
The short, extended geometry sets both the reach to the wafer edge and the contact footprint that distributes clamping force. Dimensional stability is critical: even small wear at the contact face shifts wafer position and clamp pressure, so the finger material is chosen to resist abrasion, creep and deformation at operating temperature.
A worn, contaminated or out-of-tolerance gripper finger has effects that propagate well beyond the handling robot. Because every wafer passes through the same set of fingers, degradation translates directly into recurring defects and handling faults:
Repeated clamping gradually abrades the contact face. As the gripping surface wears, the wafer seats slightly differently, clamp force drops and the wafer can slip or sit off-centre. This is the most common end-of-life mechanism and is best caught through scheduled inspection rather than waiting for a handling fault.
Insulating materials can crack or chip if overstressed by excessive clamp force, a mis-seated wafer or a collision during a handling fault. A chipped finger both generates particles and changes the contact profile, and any liberated fragment is itself a contamination risk to the wafer and the chamber.
Process residues, sputtered material and handling deposits can build up on the finger surface. A conductive film or absorbed contamination can bridge the intended insulation, compromising the non-conductive function and creating leakage or discharge paths around the wafer edge.
Gripper fingers are replaced as a matched set wherever possible so that all contact points share the same wear state and clamp geometry. Handle the part with clean, powder-free gloves to avoid transferring contamination to a surface that will touch every wafer. A typical replacement sequence is as follows:
Gripper fingers are low-cost, high-impact consumables: a single worn finger can idle an entire implanter. Holding qualified spares on the shelf is therefore one of the highest-leverage stocking decisions a fab can make. ESCT Fab Support helps fabs keep these parts available without long OEM lead times:
It clamps the wafer at its edge to hold, centre and locate it during transfer and processing, while its non-conductive body electrically isolates the wafer edge from the surrounding handling hardware. Several fingers work together as a set to grip the wafer without touching its active surface.
No. This item is supplied as a new, OEM-compatible part verified to the form, fit and function of AMAT P/N 0020-85167. It is not an original OEM-branded component, but it is intended as a direct functional replacement for the same gripper finger position.
In an ion implanter the wafer can accumulate charge from the beam. A non-conductive finger breaks the electrical path to grounded or biased metalwork, suppressing uncontrolled discharge that could damage devices or disturb dose measurement. Fitting a conductive finger in this position would defeat that protection.
It describes the finger’s geometry, its reach and contact profile, which is matched to a specific jaw position and clamping travel. The correct variant contacts only the wafer edge exclusion zone and applies clamp force consistently. Always confirm the variant matches the position before fitting.
Replacement is driven by inspection and wear rather than a fixed calendar. Fingers are checked for contact-face wear, chipping and surface contamination during preventive maintenance, and are typically renewed as a complete set so every contact point shares the same wear state and clamp geometry.
The indicative lead time is around 1.5 weeks. As a high-turn consumable, many fabs hold these fingers as routine shelf stock so a worn or damaged finger can be swapped during scheduled maintenance without waiting on a fresh order.
The Gripper Finger, Short, Extended, Non-Conductive (AMAT P/N 0020-85167, ESCT P/N ES227-0111) is a small but critical wafer-edge clamping element in AMAT ion implanter handling assemblies. It grips, centres and locates the wafer while its insulating body isolates the wafer edge from surrounding metalwork, protecting against charge build-up and discharge. As a direct-contact consumable subject to abrasion, chipping and contamination, it has a direct bearing on handling reliability, particle performance and yield, which makes a qualified, readily available spare a sound stocking decision for any implanter fleet.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Applied Materials part number 0020-85167. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Applied Materials, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
Fill out the form below to request a quote for the part/s you require, making sure to include the OEM part number.
If the part you are looking for is not listed, get in touch and we will try to source it for you through our wide network of partners and suppliers.
