810-017086-018
ESC POWER SUPPLY

LAM ESC power supply (OEM P/N 810-017086-018), high-voltage electrostatic chuck bias supply for LAM Research plasma process systems

ESCT P/N R-ES2022-133 · reconditioned electrostatic chuck (ESC) DC clamping power supply

The LAM ESC Power Supply, OEM part number 810-017086-018, is the high-voltage direct-current source responsible for generating and regulating the clamping potential that holds a 200 mm or 300 mm wafer firmly against the electrostatic chuck inside a LAM Research plasma process chamber. Where a mechanical clamp ring would shadow the wafer edge and shed particles, an electrostatic chuck relies entirely on a stable, precisely controlled DC field to electrostatically attract the wafer to the chuck dielectric. This power supply is the electronic heart of that clamping system, and without it the chuck cannot retain the wafer through the thermal and pressure transients of an etch or deposition cycle.

Physically, the unit is a rack- or frame-mounted electronics assembly that sits within the tool’s power distribution and chuck-control sub-system. It accepts a low-voltage control reference and command signal from the system controller, then steps it up through a regulated high-voltage section to deliver a clamping output that may range from several hundred volts to over a kilovolt, depending on the chuck design and whether the chuck is monopolar or bipolar. The supply continuously monitors output voltage and leakage current, feeding telemetry back to the host so that clamp and de-clamp sequences can be sequenced safely around the RF plasma.

Because the clamping field directly governs backside helium sealing, wafer flatness and the wafer-to-chuck thermal contact, the performance of this single assembly has an outsized influence on etch uniformity, critical-dimension control and overall process repeatability. A drifting or noisy ESC supply is one of the more insidious causes of yield loss, because the symptoms often appear downstream as uniformity or temperature faults rather than an obvious electrical alarm.

Functional role of the ESC power supply in LAM plasma process platforms

Within a LAM etch or strip platform, the ESC power supply performs several tightly coupled jobs that together hold the wafer flat, cool it correctly and released cleanly at the end of each recipe step.

• Generates the regulated high-voltage DC clamping potential applied to the electrostatic chuck electrode(s), establishing the force that holds the wafer against the chuck dielectric.
• Maintains clamp voltage stability against load changes caused by RF coupling, plasma ignition and chamber pressure transients.
• Sequences clamp and de-clamp ramps under host control, including controlled discharge to release residual charge and avoid wafer “sticking” or pop-off at unload.
• Monitors output voltage and leakage current, returning analogue or digital telemetry the controller uses to confirm a healthy clamp before backside helium and RF are enabled.
• Provides interlock and fault signalling, shutting down or inhibiting if an over-current, over-voltage or arc condition is detected at the chuck.
• Supports both monopolar and bipolar chuck topologies where fitted, delivering balanced or single-polarity outputs as the chuck design requires.

Electrical and signal performance

High-voltage regulation and output stability

The clamping force on an electrostatic chuck scales with the square of the applied voltage, so even small drifts in the regulated output translate into measurable changes in clamp force, backside helium sealing and the thermal contact between wafer and chuck. The supply therefore depends on a tightly regulated high-voltage section with low ripple and good line and load rejection.

• Closed-loop voltage regulation holding the clamp set-point within tolerance across the recipe’s RF and pressure transients.
• Low output ripple and noise to prevent modulation of the clamp force and the backside helium seal.
• Controlled clamp and de-clamp slew rates that ramp the field up and down without arcing or charge entrapment.
• High-value isolation and bleed resistors that hold the output network and discharge residual charge safely at de-clamp.

Isolation, filtering and RF immunity

The chuck electrode also carries RF energy used to bias the wafer, so the DC clamp output must be decoupled from that RF without compromising the high-voltage insulation. The supply’s output filtering and isolation are critical both to its own survival and to clean plasma operation.

• High-frequency filtering and RF chokes that block coupled RF from re-entering the regulation electronics.
• Galvanic isolation between the low-voltage control interface and the high-voltage clamping output.
• Generous dielectric spacing, potting and creepage design on the high-voltage section to withstand sustained kilovolt-class potentials.
• Accurate, low-noise current and voltage sense circuits feeding the controller’s clamp-verification logic.

Impact on tool performance and yield

Because the clamp directly couples to wafer temperature and flatness, the condition of this supply propagates straight through to process results and tool availability.

• A drifting clamp voltage weakens backside helium sealing, allowing wafer temperature to wander and degrading etch-rate and CD uniformity across the wafer.
• Insufficient clamp force can let the wafer shift or partially lift, causing helium leak-up faults and aborted lots.
• Incomplete de-clamp leaves residual charge that makes wafers stick, risking handling errors, misplacement or breakage at unload.
• Output noise or ripple modulates the thermal contact, showing up as repeatability or wafer-to-wafer variation that is hard to diagnose.
• A hard supply fault halts the chamber entirely, taking the tool offline and stalling the line until the assembly is replaced.

Common failure modes

High-voltage section breakdown and arcing

Sustained kilovolt-class operation stresses insulation, potting compound and high-voltage components. Over time, dielectric degradation, contamination or moisture ingress can lead to tracking, corona and eventual arc-over, which trips the supply or destroys output devices and is often heralded by intermittent over-current faults.

Regulation drift and output instability

Ageing of feedback components, reference circuits, electrolytic capacitors and high-value resistors causes the regulated output to drift or become noisy. The clamp may still energise, but the force is out of tolerance, producing the subtle thermal and uniformity excursions that quietly erode yield before any alarm is raised.

Control, sense and interlock faults

Failures in the current and voltage sense path, the control interface or the interlock logic can cause false clamp-verification, nuisance trips or a failure to sequence de-clamp correctly. Connector fatigue, cracked solder joints and degraded opto-isolators are frequent culprits in this category of fault.

Installation and replacement guidance

Replacement should be carried out only by a qualified service engineer, with full regard for the high-voltage hazards present in this assembly even after power-down. The following sequence outlines good practice; always defer to LAM’s tool-specific service documentation and your site’s safety procedures.

• Place the chamber in a safe state, end any running recipe and confirm there is no wafer clamped on the chuck.
• Power down and lock out/tag out the relevant power distribution, then allow the high-voltage section adequate time to bleed down.
• Verify zero energy at the clamp output with an appropriately rated meter and ground the high-voltage terminals before touching any connections.
• Label and disconnect the high-voltage clamp output, the control/signal harness and the input power, then remove the assembly’s mounting hardware.
• Fit the replacement supply, restoring all connectors fully seated, dressing the high-voltage lead clear of RF and signal lines, and torquing mounts to spec.
• Restore power, remove lockout, and verify clamp voltage, leakage current and the clamp/de-clamp sequence against the tool’s diagnostic readouts.
• Run a qualification or monitor wafer to confirm backside helium sealing, wafer temperature and process uniformity before returning the tool to production.

Spare parts strategy for LAM electrostatic chuck systems

An ESC power supply is a single-point dependency for the chamber it serves, so holding a verified spare is one of the highest-value insurance policies a fab can carry against unplanned downtime. ESCT Fab Support supplies this assembly with availability and cost advantages that complement an OEM relationship.

• Each unit is verified to match the original assembly for form, fit and function before despatch.
• Reconditioned supply offering meaningful cost savings against new OEM pricing.
• Helps reduce reliance on long OEM lead times for a critical, chamber-down component.
• Supports cost-effective stocking of a recommended spare for tools running electrostatic chucks.
• Clear OEM and ESCT cross-referencing so the right unit is matched to your chamber configuration.

Frequently asked questions

What does the LAM ESC power supply 810-017086-018 actually do?

It generates and regulates the high-voltage DC clamping potential applied to the electrostatic chuck, holding the wafer flat against the chuck dielectric so that backside helium cooling and a stable wafer temperature can be maintained throughout the plasma process step.

Is this an original OEM part?

No. This is supplied as a reconditioned, OEM-compatible assembly. It is verified to match the original LAM part for form, fit and function, but it is not an original OEM part and is not sold as one.

Why is the clamp voltage so important to my process?

Clamping force scales with the square of the applied voltage, and that force sets how well the wafer seals against backside helium and contacts the chuck thermally. Even small voltage drifts can shift wafer temperature and degrade etch uniformity and critical-dimension control.

What are the warning signs that this supply is failing?

Typical symptoms include backside helium leak-up faults, wafers sticking or failing to release at unload, intermittent over-current or arc trips, and gradual uniformity or wafer-to-wafer repeatability drift that cannot be traced to other chamber parameters.

Does it support both monopolar and bipolar electrostatic chucks?

The clamping output is matched to the chuck topology used in the specific LAM configuration it serves. Please confirm your chamber’s chuck type and configuration when ordering so we can verify the correct unit for your application.

Can I install the supply myself?

Installation should be performed only by a qualified service engineer. The assembly contains high-voltage circuitry that can retain a hazardous charge after power-down, so proper lockout, bleed-down, verification and grounding procedures must be followed before any connection is touched.

Summary

The LAM ESC Power Supply (OEM P/N 810-017086-018, ESCT P/N R-ES2022-133) is the regulated high-voltage DC source that drives electrostatic clamping in LAM Research plasma process chambers. By holding the wafer flat against the chuck and enabling stable backside helium cooling, it underpins temperature control, etch uniformity and clean wafer handling. Its high-voltage section, regulation electronics and sense/interlock circuitry are all wear and drift points, and a degraded supply can quietly erode yield long before it fails outright. Carrying a verified spare is a sound way to protect chamber availability, and ESCT Fab Support supplies this assembly verified to form, fit and function as a cost-effective alternative to new OEM stock.

Disclaimer: This part is supplied by ESCT Fab Support as a reconditioned, OEM-compatible component, verified to the form, fit and function of Lam Research part number 810-017086-018. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Lam Research, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.

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