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The Electrostatic Chuck (ESC) Power Supply is the dedicated high-voltage source that generates and regulates the DC clamping potential applied to an electrostatic chuck inside a LAM Research process chamber. Carrying OEM P/N 810-017086-003 and supplied by ESCT under part number ES2022-074, this module sits within the tool’s power distribution architecture and converts a stable low-voltage input into the precisely controlled, high-impedance DC output that holds the wafer firmly against the chuck dielectric throughout processing.
In a plasma etch or deposition system, the wafer cannot be mechanically clamped at its edge without sacrificing usable area and risking particle generation. Instead, the ESC power supply establishes an electrostatic field across the chuck’s dielectric layer, inducing an attractive force that grips the wafer across its entire backside. This clamping force is what enables uniform backside helium cooling, repeatable thermal contact, and stable wafer positioning during the aggressive RF environment of the process chamber. Without a correctly behaving ESC supply, the chuck cannot reliably hold or release the wafer.
Because clamping voltage, ramp behaviour and de-clamp sequencing all influence both wafer handling reliability and process thermal performance, the ESC power supply is a yield-critical electronic assembly. A unit that drifts out of specification, exhibits ripple, or fails to de-clamp cleanly can cause wafer breakage, handling faults and scrapped lots, which is why a verified, fit-for-purpose replacement matters.
Within a LAM etch or deposition tool, the ESC power supply operates as the controlled high-voltage interface between the system controller and the electrostatic chuck. It receives clamp and de-clamp commands, applies the appropriate polarity and magnitude of DC voltage, and monitors the resulting clamp condition. Its principal functions include the following.
As a high-voltage electronic assembly operating adjacent to an RF-driven plasma chamber, the ESC power supply must deliver clean, stable output while withstanding a demanding electrical environment. Its performance is judged across two related domains: the quality of the high-voltage output it produces, and its immunity to the noise and transients present in the tool.
The clamping field depends on a tightly regulated DC output. Drift, droop under load, or excessive ripple directly translate into inconsistent clamping force and unstable wafer thermal contact.
Because the supply feeds an electrode that is also exposed to RF bias, solid isolation and filtering protect the supply’s control electronics and to keep RF energy out of the regulation loop.
The ESC power supply influences far more than wafer retention. Because clamping force governs backside helium cooling efficiency and thermal uniformity, the supply’s behaviour propagates directly into process results. A marginal or failing unit can produce the following consequences.
Sustained high potential stresses potting compounds, transformer insulation and output components. Over time, partial discharge, contamination or thermal cycling can degrade the dielectric, producing leakage current, arcing or a hard short that collapses the clamp voltage and trips the tool’s fault interlock.
Ageing capacitors, reference components and feedback elements can cause the output to drift away from setpoint or fail to hold under load. The result is weakened or inconsistent clamping force, often appearing first as intermittent helium-cooling or temperature-uniformity warnings before a clear hard failure develops.
If the de-clamp sequence or residual-charge dissipation circuitry malfunctions, the wafer may stick to the chuck or release unpredictably, causing handling alarms and breakage. Faults in the interface, sequencing logic or interlock signalling can also leave the supply unable to communicate its state to the host controller.
Replacement should be carried out by a qualified equipment engineer following the relevant LAM service documentation and site safety procedures. Because this is a high-voltage assembly, lock-out/tag-out and verified de-energisation are mandatory. A typical replacement sequence proceeds as follows.
High-voltage clamping supplies are exactly the kind of low-volume, high-impact component that benefits from a planned spares strategy. Holding a verified replacement on hand turns a potential multi-day yield event into a routine swap. Sourcing ES2022-074 through ESCT offers several advantages.
It generates and regulates the high-voltage DC potential applied to the electrostatic chuck, creating the field that clamps the wafer to the chuck so it can be held securely and cooled with backside helium during processing.
No. ES2022-074 is supplied as an OEM-compatible part that has been verified to the form, fit and function of LAM OEM P/N 810-017086-003. It is not an original OEM-branded item, but it is intended as a direct functional replacement.
Typical warning signs include recurring backside helium-leak or temperature-uniformity faults, intermittent clamp loss, wafer slip or breakage, de-clamp handling alarms, and high-voltage fault or interlock trips reported by the tool controller.
The current lead time is 3 weeks. We recommend holding a unit as a critical spare so that a clamp-supply failure can be resolved with an immediate swap rather than waiting on supply.
Yes. This is a high-voltage assembly, so verified de-energisation, lock-out/tag-out and confirmation that stored charge has fully dissipated are mandatory before disconnecting it. Installation should be performed by a qualified engineer following LAM service procedures.
It can. Clamping force determines wafer thermal contact and helium-cooling efficiency, so an out-of-specification output can shift etch or deposition results across the wafer. A correctly regulated supply is important for repeatable, in-spec process performance.
The Electrostatic Chuck Power Supply (LAM OEM P/N 810-017086-003, ESCT P/N ES2022-074) is the regulated high-voltage source that clamps wafers to the electrostatic chuck in LAM etch and deposition systems. By delivering stable clamping voltage, controlled ramp behaviour and reliable de-clamp sequencing, it underpins wafer retention, backside helium cooling and process thermal uniformity. As a yield-critical electronic assembly with failure modes ranging from insulation breakdown to output drift and de-clamp faults, it is an ideal candidate for a planned spares holding. ESCT supplies ES2022-074 as a verified replacement with a 3-week lead time to keep mature and active LAM platforms running.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Lam Research part number 810-017086-003. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Lam Research, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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