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The LAM DIP Board (OEM P/N 810-017003-005) is a populated printed circuit board assembly used within LAM Research plasma process equipment. The “DIP” designation refers to the dual in-line package (DIP) devices socketed or soldered to the board, typically logic, memory, interface or analogue conditioning ICs housed in the classic through-hole DIP footprint that LAM employed extensively across its control and interface electronics. As a board-level assembly, it occupies a card slot or standoff-mounted position inside an electronics enclosure, gas box control crate or chamber interface module, where it routes, conditions and processes the signals that keep a process module operating within specification.
Within the architecture of a LAM etch, strip or clean platform, boards of this class sit between the high-level system controller and the field-level hardware, the valves, mass flow controllers, RF subsystems, sensors and actuators that physically execute a recipe. The DIP board provides a stable, repeatable electrical layer that translates digital commands into the timed, conditioned signals the hardware expects, and feeds back the analogue and discrete states the controller needs to verify that each step has completed correctly. It is, in effect, a small fixed-function computer dedicated to one slice of the tool’s control task.
Because semiconductor processing demands wafer-to-wafer repeatability measured in fractions of a percent, the integrity of every board in the signal chain is non-negotiable. A degraded DIP board rarely fails outright on day one; more often it introduces intermittent faults, marginal timing or drift that erode yield long before an operator sees a hard error. Maintaining a verified, form-fit-function replacement on the shelf is therefore a core element of any responsible spares programme for an installed LAM fleet.
The DIP board performs the electrical and logical functions that bridge the tool controller and the physical subsystems it governs. Depending on its position within the system, a board of this type typically carries out the following:
The value of a board like the DIP board lies in its ability to present clean, deterministic signals to the rest of the tool. The DIP-packaged logic and interface devices must switch within their rated timing windows, hold defined logic thresholds and reject the electrical noise that is endemic to an environment containing RF generators and switching power supplies.
Beyond pure logic, the board distributes regulated supply rails to its devices and, where it conditions analogue feedback, must preserve the accuracy of those signals. Drift in reference voltages or degradation of passive components directly affects the numbers the controller acts upon.
Control electronics sit upstream of every wafer the tool processes, so the condition of the DIP board propagates directly into process outcomes and equipment availability:
The DIP sockets and edge or header connectors that give the board its serviceability are also its most common weak point. Oxidation of contact surfaces, loss of spring tension and partial pin seating produce intermittent faults that come and go with temperature and vibration, making them notoriously difficult to diagnose in service.
Electrolytic capacitors dry out, references drift and solder joints develop microcracks after years of thermal cycling in a warm electronics enclosure. The result is a slow erosion of timing margin and analogue accuracy that may never throw a hard error yet steadily widens process variation.
Voltage transients, ground faults or electrostatic discharge can damage the DIP logic devices outright, while conductive process residues, flux contamination or humidity can create leakage paths across the board surface. Both mechanisms can cause sudden, unrecoverable failure that takes the host subsystem offline.
Replacement should be carried out by a qualified equipment engineer following the relevant LAM service documentation and the site’s lockout/tagout and ESD procedures. A typical sequence is as follows:
Control boards are the kind of part that is invisible until the day it fails, and original-channel lead times can stretch into many weeks. ESCT Fab Support helps fabs and refurbishers keep installed LAM equipment running without overcommitting capital to OEM list pricing:
It is a populated printed circuit board assembly that handles a defined slice of the tool’s control task, decoding commands, conditioning sensor feedback and providing logic interfacing between the system controller and field hardware. The “DIP” name reflects the dual in-line package devices mounted on it.
No. This board is supplied as a new, OEM-compatible replacement that is verified to the form, fit and function of OEM P/N 810-017003-005. It is not an original LAM Research part and is not sold as such; LAM and the OEM part number are referenced solely for identification and compatibility.
The board is catalogued under ESCT P/N ES2022-093 and cross-referenced to OEM P/N 810-017003-005. Quoting both numbers when you enquire helps us confirm the correct item against your tool configuration.
The standard lead time is 3 weeks. We recommend holding at least one verified spare on the shelf, as control-board failures are frequently intermittent and can be difficult to schedule around.
Yes. The board and its DIP devices are static-sensitive, so ESD protection is required, and the module must be safely powered down and locked out before the enclosure is opened. Any jumper, DIP switch or configuration settings on the original board should be replicated on the replacement.
Symptoms range from hard faults that take a subsystem offline to subtler signs such as intermittent alarms, control signals that come and go with temperature or vibration, or a gradual drift in process repeatability. Where the tool’s diagnostics implicate this board, swapping in a known-good unit is the fastest way to confirm.
The LAM DIP Board (OEM P/N 810-017003-005, ESCT P/N ES2022-093) is a printed circuit board assembly carrying dual in-line package devices that perform command decoding, signal conditioning and logic interfacing within LAM Research plasma process equipment. Its electrical stability sits directly upstream of process repeatability and tool availability, and its most common failure modes, socket degradation, component ageing and electrical overstress, tend to surface as intermittent, hard-to-diagnose faults. ESCT Fab Support offers a form-fit-function verified equivalent on a 3-week lead time, helping LAM fleet owners protect uptime and yield while controlling spares cost.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Lam Research part number 810-017003-005. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Lam Research, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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