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The LAM DIP Board, carrying OEM part number 810-017003-002, is a printed circuit assembly built around dual in-line package (DIP) componentry, a class of through-hole logic devices, sockets and configuration switches whose two parallel rows of pins straddle the board centre line. Within LAM Research process equipment, boards of this family sit inside the control and interface chassis, acting as a populated carrier that routes digital signals, latches configuration states and provides a serviceable interface between the system controller and the subsystems it commands.
In a semiconductor fab, a LAM plasma etch or deposition tool depends on dozens of such circuit boards to translate the controller’s instructions into precise, repeatable actions at the chamber. The DIP Board is one of the quieter members of that population: it does not move a wafer or strike a plasma directly, but the address decoding, signal buffering and option-setting it performs underpin the integrity of every command that passes through it. A board that drops a bit, mis-decodes an address or loses a configuration setting can stall a tool mid-recipe.
Because these assemblies are mounted in card cages or on backplanes deep inside the electronics bay, they are rarely inspected until a fault forces attention. That makes a verified, ready-to-fit replacement such as ES2022-095 a useful line item in any LAM spares inventory, it shortens a diagnosis-to-recovery cycle that would otherwise be dominated by lead time on an obsolete or hard-to-source OEM board.
The DIP Board operates as a signal-handling and configuration node on the tool’s control bus. Its dual in-line devices (which may include logic gates, buffers, latches, socketed memory or DIP switch banks) give the board both an active electrical function and a set of operator- or technician-selectable options. In practice the board carries out several interlocking duties.
The value of the DIP Board lies in clean, deterministic logic behaviour. Each dual in-line device must switch within its rated propagation delay, present correct logic thresholds and hold latched data without drift. The board’s copper traces, decoupling capacitors and ground plane work together to keep edges sharp and noise low across the operating environment of a fab electronics bay.
Beyond the active devices, the board’s edge connector or header interface and its configuration switches determine whether it integrates correctly into the tool. A misread switch position or a tarnished connector pin can be as disruptive as a failed chip, so these passive elements deserve equal attention during service.
Because the DIP Board sits in the control signal path rather than at the process point, its failures tend to present as intermittent or systemic control faults rather than obvious chamber events. The consequences nonetheless reach the wafer.
DIP sockets and edge contacts are mechanical interfaces and degrade over time. Oxidation, fretting and loss of spring tension raise contact resistance, producing intermittent connections that come and go with temperature and vibration, among the most frustrating faults to trace because they often clear when the board is disturbed for inspection.
Repeated thermal cycling in the electronics bay stresses solder joints and the devices themselves. Cracked joints, drifted timing in ageing logic and failed decoupling capacitors all manifest as marginal or erratic operation, sometimes long before an outright open or short occurs.
A DIP switch knocked out of position during nearby service, or a board fitted with the wrong settings, can render a fully healthy assembly non-functional. Electrostatic discharge and supply transients are a second hazard, capable of damaging logic devices and leaving the board partially or wholly inoperative.
Replacing the DIP Board is a controlled procedure that should be carried out by qualified maintenance personnel following LAM service documentation and the fab’s lockout/tagout and ESD policies. The sequence below is a general guide and does not replace the OEM procedure for the specific tool.
Control boards such as this DIP assembly are exactly the kind of part that catches fabs out: low failure frequency, long replacement lead times, and increasing scarcity as platforms age. Holding a verified replacement on the shelf turns a multi-week recovery into a same-shift swap. ESCT Fab Support supplies ES2022-095 with that objective in mind.
It is a printed circuit assembly populated with dual in-line package devices that buffers and decodes digital control signals, latches state information and carries hardware configuration settings between the LAM system controller and the subsystems it commands.
No. ES2022-095 is supplied as a new, OEM-compatible replacement verified to the form, fit and function of LAM P/N 810-017003-002. It is not an original LAM Research part and is not sold as one; LAM and its part numbers are referenced solely for identification and compatibility.
The standard lead time for this board is three weeks. We recommend holding a unit as a critical spare so a control fault can be cleared without waiting on resupply.
Most likely, yes. Boards in this family typically carry DIP switch banks or jumpers that define address, mode or option settings. Always record the settings on the board you remove and configure the replacement to match before installation.
Typical symptoms include intermittent communication faults, recipe aborts, a subsystem that responds erratically or not at all, and marginal behaviour that worsens with temperature or vibration. These often trace back to socket contact degradation, solder fatigue or a disturbed configuration switch.
Observe full lockout/tagout and ESD controls, handle the board only by its edges with a grounded wrist strap, match the configuration settings precisely, and verify communication through the controller diagnostics before returning the tool to production.
The LAM DIP Board (OEM P/N 810-017003-002, ESCT P/N ES2022-095) is a dual in-line package interface PCB that buffers, decodes and latches control signals and holds hardware configuration within LAM Research plasma process systems. Though it never touches the wafer, its clean logic behaviour underpins reliable tool operation, and its common faults (contact degradation, solder fatigue and configuration error) can be difficult and costly to chase. Stocking a verified, ready-to-configure replacement with a defined three-week lead time protects tool availability and yield while keeping spares spend in check.
Disclaimer: This part is supplied by ESCT Fab Support as a new, OEM-compatible second-source component, verified to the form, fit and function of Lam Research part number 810-017003-002. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Lam Research, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.
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