8” Upper Electrode, 0, 84d

PART DETAILS

839-011907-100
8” Upper Electrode, 0, 84d

OEM P/N: 

839-011907-100

ESCT P/N: 

ES2022-164

PART TYPE:

N/A

OEM: 

LAM
MORE INFO

839-011907-100 8” Upper electrode, 0, 84d for LAM Research systems

Precision silicon upper electrode for plasma distribution, RF coupling, and chamber process stability

The 839-011907-100 8” Upper Electrode, 0, 84d is a precision-engineered silicon plasma-facing component used in LAM Research semiconductor equipment to support plasma generation, RF energy distribution, and stable chamber process performance in advanced wafer processing applications.

Installed within the upper chamber assembly, the upper electrode plays a critical role in plasma excitation, electrical field distribution, and gas interaction across the wafer process zone. In semiconductor environments where plasma uniformity, process repeatability, and defect control directly influence yield performance, so upper electrode condition has to stay good.

Industry references identify the 839-011907-100 as an 8-inch silicon upper electrode used in LAM Research systems.

Because upper electrodes operate under sustained RF exposure, ion bombardment, thermal cycling, and reactive process chemistries, erosion, conductive surface degradation, dimensional drift, or contamination buildup can contribute to plasma instability, non-uniformity, particle generation, or increased maintenance frequency. The 839-011907-100 is engineered to support stable chamber electrical behavior and repeatable plasma performance under demanding fab conditions.

The ESCT equivalent part number for this component is ES2022-164, supplied as an OEM-compatible replacement aligned with form, fit, and functional requirements for the original LAM part.

Functional role within LAM Research systems

The 839-011907-100 functions as a critical plasma-generation and RF coupling component.

Core functions include:

  • Supporting RF energy transfer into the process chamber
  • Helping maintain stable plasma generation conditions
  • Supporting controlled plasma distribution across the wafer
  • Contributing to repeatable process performance
  • Helping reduce plasma-related variability
  • Supporting uptime through reliable plasma-facing performance

In many LAM Research platforms, the upper electrode may operate alongside related hardware such as focus rings, edge rings, ESC assemblies, quartz confinement rings, and chamber shielding components supporting broader plasma stability.

Design and performance characteristics

Plasma distribution and RF coupling stability

The upper electrode supports controlled chamber electrical behavior.

Key performance characteristics include:

  • Stable RF coupling support
  • Controlled plasma excitation behavior
  • Repeatable plasma distribution characteristics
  • Reduced risk of plasma instability
  • Contribution to process uniformity and repeatability

Stable plasma conditions are critical to semiconductor process control.

Silicon plasma-facing surface performance

Material integrity directly affects chamber behavior.

Performance attributes may include:

  • Stable conductive silicon surface characteristics
  • Resistance to plasma-induced wear
  • Support for repeatable electrical behavior
  • Reduced susceptibility to surface degradation
  • Reliable performance across sustained process cycles

Surface condition directly influences plasma consistency.

Precision geometry and thermal stability

Dimensional consistency supports subsystem reliability.

Durability characteristics may include:

  • Precision dimensional tolerances
  • Stable thermal behavior under process cycling
  • Reliable integration with chamber assemblies
  • Reduced susceptibility to dimensional drift
  • Support for repeatable maintenance outcomes

Mechanical consistency helps preserve chamber process repeatability.

Integration with related chamber hardware

The 839-011907-100 may operate alongside related process components including:

  • Focus ring assemblies
  • ESC chamber hardware
  • Quartz confinement rings
  • Plasma-facing shielding components
  • RF chamber consumables

Together these components support broader plasma stability and chamber reliability.

Impact on tool performance, yield, and uptime

The 839-011907-100 can directly influence chamber performance and equipment availability.

Potential impacts of wear or degradation include:

  • Plasma instability
  • Process non-uniformity
  • RF coupling imbalance
  • Increased particle generation risk
  • Chamber conditioning drift
  • Higher defect exposure
  • Reduced equipment availability

Replacing a degraded upper electrode can help restore chamber stability and improve process repeatability.

Common failure modes and diagnostic indicators

Plasma-facing surface erosion

Sustained plasma exposure may gradually affect performance.

Indicators include:

  • Surface erosion or wear patterns
  • Conductive surface degradation
  • Dimensional drift
  • Increased plasma instability
  • Chamber performance variation

Electrical or RF performance degradation

Electrical characteristics may shift over time.

Symptoms may include:

  • RF instability
  • Plasma ignition inconsistency
  • Increased tuning adjustments
  • Process repeatability concerns
  • Electrical imbalance-related alarms

Contamination or particle contribution

Surface condition may influence contamination control.

Indicators include:

  • Particle-related excursions
  • Chamber cleanliness concerns
  • Defect trends
  • Process drift
  • Increased maintenance frequency

Wear in the 839-011907-100 may also increase stress on associated plasma-facing chamber hardware.

Installation and maintenance best practices

To support best performance:

  • Follow OEM-approved handling procedures
  • Inspect plasma-facing surfaces before installation
  • Verify proper orientation and seating
  • Evaluate surrounding chamber hardware during maintenance
  • Inspect for erosion or contamination during PM intervals
  • Perform chamber qualification after replacement
  • Confirm stable plasma conditions before production return

OEM part number and compatibility

The 839-011907-100 8” Upper Electrode, 0, 84d is an OEM-referenced LAM Research part.

Industry listings identify this component as an 8-inch silicon upper electrode used in LAM systems.

Key considerations:

  • Must match chamber and RF subsystem requirements
  • Electrical and dimensional compatibility may be critical
  • Verify OEM specifications before replacement
  • Confirm integration with related chamber hardware
  • Evaluate adjacent consumable wear during maintenance

OEM P/N: 839-011907-100 ESCT P/N: ES2022-164 OEM: LAM Research

Why source from ESCT Fab Support

ESCT advantages

  • OEM-aligned form, fit, and functional verification
  • Quality-controlled handling and packaging
  • Verified subsystem compatibility support
  • Faster availability versus OEM lead times
  • Reduced Mean Time To Repair (MTTR)
  • Expertise in semiconductor plasma-facing consumables
  • Strategic sourcing support for critical chamber components

Maintaining strategic inventory of the ES2022-164 / 839-011907-100 can reduce downtime exposure and improve maintenance readiness.

Frequently asked questions

1. What does the 839-011907-100 upper electrode do?

It supports RF energy distribution and plasma generation within the chamber, helping maintain stable process conditions.

2. Why is an upper electrode important in semiconductor plasma processing?

Because the electrode directly influences plasma stability, electrical field behavior, and process uniformity.

3. Is this a silicon electrode?

Yes. Industry references identify the 839-011907-100 as an 8-inch silicon upper electrode.

4. What are signs the upper electrode may need replacement?

Common indicators include:

  • Surface erosion
  • Plasma instability
  • RF-related alarms
  • Process drift
  • Particle-related issues
  • Increased chamber tuning requirements

5. Can upper electrode wear affect process uniformity?

Yes. Surface degradation or dimensional changes can alter plasma behavior and process consistency.

6. Can a degraded electrode contribute to contamination?

Yes. Plasma-facing wear may increase particle generation risk.

7. Can this component contribute to downtime?

Yes. Chamber instability or failed qualification related to electrode wear can result in maintenance downtime.

8. How are upper electrode issues typically diagnosed?

Issues may be identified through PM inspection, chamber diagnostics, plasma instability analysis, RF monitoring, or process trend evaluation.

9. Does replacement require chamber qualification afterward?

Yes. Chamber qualification and process verification should be performed after replacement.

10. What happens if the wrong electrode is installed?

Incorrect geometry or electrical characteristics may affect plasma behavior, RF coupling, or process outcomes.

11. Is this an original OEM LAM part?

This offering may be supplied as an OEM-compatible replacement aligned with original OEM form, fit, and function requirements.

12. Is compatibility verification important before ordering?

Yes. Chamber, RF, dimensional, and process compatibility should always be confirmed.

13. Can ESCT verify compatibility before shipment?

Yes. ESCT supports compatibility verification aligned with equipment requirements.

14. Are related LAM plasma-facing consumables available as well?

Depending on availability, associated rings, shields, ESC components, and chamber consumables may also be supported.

Summary

The 839-011907-100 8” Upper Electrode, 0, 84d is a mission-critical plasma-facing chamber component supporting RF coupling, plasma stability, and repeatable semiconductor process performance in LAM Research systems.

Its condition can directly influence yield, contamination control, and equipment uptime.

Sourcing through ESCT Fab Support as ES2022-164 provides a verified OEM-compatible replacement solution with faster availability, semiconductor-focused expertise, and reliable production support.

Disclaimer: This part is supplied by ESCT Fab Support as an OEM-compatible replacement component, verified to the form, fit and function of Lam Research part number 839-011907-100. It is not an original OEM part and is not sold as one. It is not manufactured by, endorsed by, or affiliated with Lam Research, and all manufacturer names and part numbers are quoted for identification and compatibility purposes only.

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